New-Tech Europe Digital Magazine | May 2016

new products

Expands Optical Image Stabilization Portfolio, Bringing Superior Picture Quality to Built-In Camera Applications ON Semiconductor (Nasdaq: ON ),driving energy efficiency innovations, introduces its next generation Optical Image Stabilization (OIS) / Auto Focus (AF) driver, LC898123AXD,to its portfolio, offering a premier digital still camera and video experience for smart phones, tablets, notebooks, and wearables, by using advanced auto-focus, and optical image stabilization technologies to overcome the performance limitations of traditional camera modules. The LC898123AXD OIS / AF driver integrates a DSP core with multiple analog peripherals for image stabilization, auto-focus control, and H-bridge and constant-current drivers. The addition of on-chip Flash memory provides storage for the DSP program and calibration parameters, thus saving 90% of the overhead time needed to load from conventional memory on startup. This highly integrated solution enables faster implementation of OIS and AF functionality into camera modules while remaining compatible with a wide array of image sensors. Furthermore, the high level of functional integration supports the need for very thin camera modules. “There is growing demand for enhanced image clarity and quality in the latest smartphone models, as on-the-go consumers expect to derive better and better user experiences regardless of device size,” said Tomofumi

Global Product Manager for High Reliability Connectors: “As electronics becomes pervasive in harsh environments where high levels of shock and vibration are experienced, customers are demanding fixing solutions that provide the highest confidence levels. Autosport teams, for example, that used to use plastic latches are now moving over to jackscrews for added security. Robotics is another example where repeated mating can lead to the latch wearing, so jackscrews are now commonly preferred.” Harsh conditions Satellites, especially miniature CubeSats, are relying on jackscrews not only to ensure that the connection survives harsh operation conditions, but also to save space. Flower: “One Datamate customer is using the jackscews to connect four boards in a box section. The boards then become self-supporting and the use of space – always a concern in satellite design – is maximised.” Harwin recommends that users torque Datamate jackscrews to 21 +/- 2 cN/m. This ensures that devices meet EIA specifications for vibration severity. Jackscrews are available with all Harwin’s Datamate and Mix-Tek (mixed signal, power and coax) connectors. Find more information on Datamate and the Datamate J-Tek range, or download the Datamate Jackscrew guide

Watanabe, Business Unit Leader of the Power Solutions Products in Intelligent Power Solution Division at ON Semiconductor. “The LC898123AXD enables camera module designers to meet these ever demanding requirements”. The LC898123 has best-in-class current consumption, enabling improved battery lifetime. The DSP performance and flexibility allows support for various VCM actuators. The high-performance 32-bit DSP optimized for OIS/AF signal processing covers many functions, such as servo control, gyro data filtering, and host command interface. In addition, the LC898123 offers “High Level Command” function to standardize commands from the main CPU to the camera module, enabling phone developers to use standardized commands for multiple camera modules/actuators without changing CPU software. Reference designs dedicated to Camera Module Integrators are available, accelerating the OIS/AF evaluation as well as reduce the The LC898123AXD is offered in a Pb-free WLCSP-35 package and is priced at $ 2.18 per unit in 4,000 unit quantities. development workload. Packaging and Pricing

Infineon and GoerTek

ON Semiconductor

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