New-Tech Europe | January 2016

components suitable for space applications. Requirements vary widely depending on many factors including the component type, materials, and other details specific to the flight program. Mini-Circuits has successfully screened hi-rel components for a range of space requirements, and this experience has enabled us to develop well- established qualification processes for these demanding applications. For more information about qualifying parts for space applications, please contact our applications team

Qualification Flow

Qualification Flow

Qualification Flow

Units from Stock or New Production

Units from Stock or New Production

Units from Stock or New Production

Humidity +85˚C and +85RH, 1.3VDC ±0.25VDC test voltage applied

Humidity +85˚C and +85RH, 1.3VDC ±0.25VDC test voltage applied

DPA

DPA

12 Units

12 Units

External visual inspection a)

Extern l visual inspection

a)

Humidity +85˚C and +85 1.3VDC ±0.25V test voltage appl

Prohibited materials analysis of external surfaces b)

Prohibi d materials analysis of external surfaces

b)

DPA

Internal visual inspection of sectioned devices c)

Intern l vi ual inspection f sectioned devices

c)

Destructive Electrical Screening @ +25˚C, -55˚C, and +100˚C; samples soldered on PCB a) b)

Destructive Electrical Screening @ +2 ˚C, -55˚C, and +100˚C; samp es soldered on PCB

10 Units Prohibited materials analysis of external surfaces External visual inspection

10 Units

Thermal Shock -55 to +125˚C

Thermal Shock -55 to +125˚C

Internal visual inspection of sectioned devices

c)

10 Cycles, 10 Minutes

10 Cycles, 10 Minutes

Destructive Electrical Screen @ +25˚C, -55˚ and +100˚C; samples solder on PCB

GROUP B Sample Screening

GROUP B Sample Screening

Solderability Units soldered on test board and inspected per IPC-A-610

Solderability Units soldered on test board and inspected per IPC-A-610

5 Units

5 Units

Bake-In 24 hr. stabilization bake exposure at +100˚C

Bake-In 24 hr. stabilization bake exposure at +100˚C

Thermal Shock -55 to +125˚C

3 Units 10 Cycles, 10 Minutes

Leach Resistance Immersion in +260˚C solder, 10 sec.

Leach Resistance Immersion in +260˚C solder, 10 sec.

Real-Time Radiographic Inspection 2 views

Real-Time R diographic Inspection 2 views

3 Units

GROUP A

GROUP A

100% Screening

100% Screening

Solderability Units soldered test board an inspected per IPC-A-610

3 Units Bake-In 24 hr. stabilizatio bake exposure at +100˚C

Terminal Strength Push force of 0.5mm/s applied to samples soldered to test board

Terminal Strength Push force of 0.5mm/s applied to samp es soldered to test board

Final Visual/Mechanical Inspection 10x magnification; 5 units inspected for dimension

Final Visual/Mechanical Inspection 10x m gnification; 5 units inspected for d mension

3 Units

Leach Resistan Immersion in +260˚C solder 10 sec.

Figure 2: Qualification flow for LTCC low pass filter for a specific space flight program. Figure 2: Qualification flow for LTCC low pass filter for a specific space flight program.

Real-Time Radiographic Inspection 2 views

Table 1: Screening process summary

GROUP A

100% Screening

Terminal Stren Push force o 0.5mm/s applie samples soldere test board

Final Visual/Mechanical Inspection 10x magnification; 5 units inspected for dimension

3

3

Figure 2: Qualification flow for LTCC low pass filter for a specific space flight pr

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