New-Tech Europe | July 2018

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Toshiba announce new analog output IC photocoupler for automotive applications Toshiba Electronics Europe (“Toshiba”) announces the launch of a new analog output IC photocoupler that enables high-speed communications in automotive applications – especially electric vehicles (EV) and hybrid electric vehicles (HEV). The new TLX9309 consists of a high-output GaAlAs light emitting diode (LED) that is optically coupled to a high- speed detector. The detector consists of a photodiode and a transistor integrated onto a single chip. A Faraday shield has been integrated onto the photodetector chip to provide enhanced levels of common-mode transient immunity – typically up to 15kV/μs, an important parameter in electrically noisy automotive environments. By separating the photodiode and amplification transistor, the collector capacitance is reduced, reducing propagation delays and making the open-collector TLX9309 faster than transistor output devices. In fact, propagation delay times are guaranteed to be between 0.1μs and 1.0μs, with the difference between high to low and low to high transition (|tpLH-tpHL|) being no more than 0.7μs, making the device suitable for high-speed communications such as inverter control or as an interface to intelligent power modules (IPM). Electrically, the device offers 3750Vrms of isolation with 5.0mm of creepage and clearance for safety isolation. It operates from a supply in the range -0.5 to 30V DC and can drive up to 25mA at output voltages up to 20V. The current transfer ratio is in the range 15-300 % The TLX9309 is packaged in a 3.7mm x 7.0mm x 2.2mm RoHS compliant 5-pin SO6 package and operates over the temperature range -40°C to +125°C. The device is AEC-Q101 qualified for use in automotive applications.

Anritsu announces MT8000A Test Platform to Support MediaTek Inc on 5G Chipset Development and Verification MediaTek Incorporated and Anritsu Corporation agreed to forge a partnership for 5G development and physical layer verification. MediaTek Inc. selected Anritsu’s MT8000A Radio Communication Test Station as a prioritized test platform for the verification of standard- based 5G NR chipset targeting upcoming global 5G deployment. Anritsu, a leader in mobile communications testing will support MediaTek’s development of 5G devices such as baseband chipset by providing powerful and efficient test solutions from early phase of pre-silicon verification to commercial validation stage of RF, protocol and function to enable launch of 5G chipset to the market with high quality. Anritsu designed its new 5G test platform, MT8000A for the latest technologies, such as wideband signal processing and beamforming, required by ultrafast and large-capacity 5G communications. The all-in- one platform supports sub-6 GHz and millimeter-wave RF tests and as well as protocol tests. Anritsu’s long experience in supplying 3G and 4G test solutions to MediaTek Inc. will help facilitate smooth development and early deployment of 5G products. Anritsu will continue contribution to MediaTek’s 5G development strategy by providing the latest test solutions and dedicated support.

New Current Sense Transformers Now Available at Wurth Electronics Midcom Wurth Electronics Midcom is proud to announce the release of additional Current Sense transformers to the

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