New-Tech Europe | June 2017

new products

Allegro MicroSystems, LLC Announces New High Current Integrated DC Motor Driver IC Allegro MicroSystems, LLC announces a new motor driver IC designed for pulse-width-modulated (PWM) control of DC motors. Allegro’s A5950 is capable of peak output currents up to ±3 A and operating voltages up to 40 V. This new device is targeted at the automotive market with end applications to include heads-up-display, shift drive, door closure and engine thermal management applications. It is also targeted at the commercial market to drive brush DC motors for ATM cash dispensers, robotic vacuums, printers, copiers and ticketing and vending applications. Input terminals are provided for use in controlling the speed, direction and torque of a DC motor with externally applied PWM control signals. Internal synchronous rectification control circuitry is provided to lower power dissipation during PWM operation and low current standby mode is included to improve efficiency. Internal circuit protection includes overcurrent protection, motor lead short to ground or supply, thermal shutdown with hysteresis, undervoltage monitoring of VBB, and crossover-current protection. Diagnostic features include an analog output that can be used to monitor the current through the external sense resistor and an open drain FAULTn output. The A5950 is supplied in a low-profile 4 mm × 4 mm, 16-contact QFN (suffix “EU”) package with wettable flank option (suffix “-J”), or a 16-lead eTSSOP (suffix “LP”), both with exposed power tab for enhanced thermal performance. Allegro MicroSystems, LLC is a leader in developing, manufacturing and marketing high-performance semiconductors. Allegro’s innovative solutions serve high-growth applications within the automotive market, with additional focus on office automation, industrial, and consumer/communications solutions. Allegro is headquartered in Worcester, Massachusetts (USA) with design, applications, and sales support centers located worldwide. Further information about Allegro can be found at www.allegromicro.com.

CUI Further Expands Thermal Management Portfolio with New Line of Heat Sinks CUI’s Thermal Management Group today announced an expansion to its existing portfolio of Peltier devices and dc fans with the addition of a heat sink product line. The new line of aluminum heat sinks, available in both extruded and stamped versions, are compatible with TO-218, TO-220, TO-252, and TO-263 transistor packages. Designed to improve the heat dissipation of low and high power board level applications, these stampings and extrusions are conveniently measured under four conditions for thermal resistance, making it easier to select the optimal heat sink for natural convection or forced air cooled systems. The extruded and stamped heat sinks offer tin plated or black anodized material finishes and are available with or without solder pins in vertical or horizontal orientations. Thermal resistances measured at 75°C ΔT in natural convection environments are as low as 4.49°C/W, while power dissipation ratings measure up to 16.7 W at 75°C ΔT in natural convection. Along with their standard form factors and sizes, CUI also offers a range of custom heat sink capabilities. With alternate production methods such as forging and die casting as well as extrusions and stampings, CUI can create virtually any shape or profile to fit specific design needs. A variety of additional materials and finishes are available, including clear and color anodization, chromate powder coating, and nickel or zinc plating. Hole punching for custom mounting patterns is also an option. In addition, CUI’s standard or custom heat sinks can be integrated with any of its current Peltier and dc fan offerings to achieve more complex thermal solutions. “At CUI, we see the development and expansion of our thermal management product line as a natural complement to our industry leading portfolio of power products,” stated Kraig Kawada, CUI’s VP of Product Management. “As the heat in applications continues to rise due to increasing power densities, we believe that the introduction of these heat sinks, alongwith our current Peltier devices and dc fans will assist our customers in meeting their growing thermal management challenges.”

80 l New-Tech Magazine Europe