New-Tech Europe Magazine | Aug 2018

Contents

10 LATEST NEWS 16 Simplifying CSP Manufacturing By Improving Heliostat Design 20 Conquering wireless connectivity challenges with simple, low-power proprietary wireless solutions 26 The potential of sequential-3D integration for advanced semiconductor scaling 28 Connector Designs To Address Data Rate and Density Challenges 32 “Qualcomm’s latest antenna module announcements bring 5G smartphones closer to commercial reality.” 34 On-chip optical filter processes wide range of light wavelengths

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36 OUT OF THE BOX 38 NEW PRODUCTS 46 INDEX

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