New-Tech Europe Magazine | H2 2023
PCIe Gen 5 bandwidths with 32 gigatransfers per second (GT/s). This makes it possible to use latest GPUs and SSDs in combination with latest processor technology, such as 13th Gen Intel Core processors, for optimum results. Higher bandwidth is immensely important because of the ever-larger AI and high-performance computing datasets, and because loading this data is crucial for the end-to-end performance of applications. If the systems are massively networked as edge nodes, native on-board support of a second Ethernet interface as well as higher Ethernet bandwidth are also essential. The leap from 1x GbE to up to 2x 10 GbE with TSN and 2x 10 GbE via Serdes offers an immense performance boost for such systems, along with the option to implement line or ring networking instead of star networking. Another useful feature is the support of up to 4x USB 4.0, 4x USB 3.2 x1 / USB 3.2 x1 + 8x USB 2.0 for numerous extensions or easy Thunderbolt 4 implementation. This allows transmission of power supply, user input, and high-resolution video signals to HMIs via a single cable, or to connect up to five additional devices in series: docking stations, hubs, external PCIe devices, external graphics, and up to two 4k displays. This and numerous other enhancements make COM HPC the standard of the future. And thanks to COM-HPC Mini, it can now be implemented with relatively little effort since in principle only the carrier board and the cooling solution for the module need to be adapted. embedded world highlight: COM-HPC Mini The flagships among congatec’s embedded world presentations are therefore early samples of a COM HPC Mini design. These first high performance COM-HPC Mini modules, which will be officially launched after the
Figure 1: 13th generation Intel Core processors: congatec provides them on COM Express Compact as well as COM-HPC Client Size C, A and Mini modules (from left). Credit: congatec
Figure 2: The many new high-speed interfaces provided on COM-HPC Mini’s footprint of 95x70 mm are very attractive for compact high-performance box
and DIN rail PCs. Credit: congatec
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