New-Tech Europe Magazine | Jan 2018

January 2018

New-Tech Europe January 2018

20 CES 2018: Catalyst of Innovation 22 New silicon structure opens the gate to quantum computers 30 How Perceptual Computing Enables an Entire New Class of Imaging Applications 32 Fast and Straightforward Implementation of Serial Interfaces

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January 2018

About New-Tech Magazines Group Read To Lead ‘New-Tech Magazines’ A world leader in publishing high-tech and electronics, producing top quality publications read by tens of thousands professionals from all over the world especially from Europe, innovative electronics, IoT, microwave, homeland security, aerospace, automotive and technological industries. Our specialized target audiences prefer New-Tech Europe because they know that our publications are a reliable source of the latest information in their respective fields. Our multidimensional editorials, news items, interviews and feature articles provide them with a full, well-rounded picture of the markets in which they operate - an essential asset for every technological leader striving to stay ahead, make the right decisions, and generate the next global innovation. Moreover, as an attractive platform for advertisers from around the world, New-Tech Europe has become a hub for bustling international commercial activity. Here, through ads and other promotional materials, Israeli readers obtain crucial information about developers and manufacturers worldwide, finding the tools, instruments, systems and components they need to facilitate their innovative endeavors. Targeting the needs of both the global and european industries and global advertisers, New-Tech Magazines Group constantly expands and upgrades its services. Over the years, the company has been able to formulate a remarkably effective, multi-medium mix of offerings, combining magazine publications with useful online activities, newsletters and special events and exhibitions.

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mayaco@gmail.com Technical counselor: Arik Weinstein Sales and advertising:

sales@new-techmagazine.com Account Manager: Tatiana Yamin Account Manager: Irit Shilo Account Manager: Rinat Zolty Meroz Account Manager: Ricky Shlezinger Project Manager: Ayelet Arran Project Manager: Yaara shahaf Administration: Shir Ben David Editorial coordinator: Lihi Levi Mail: Office: info@new-techmagazine.com Publisher : NEW-TECH MAGAZINE GROUP LTD Data system: Liat Tsarfati Administration: Lihi Levi

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Contents

10 LATEST NEWS 20 CES 2018: Catalyst of Innovation 22 New silicon structure opens the gate to quantum computers 24 Phase Alignment and Control on the ADF4356/ ADF5356 Devices 30 How Perceptual Computing Enables an Entire New Class of Imaging Applications 32 Fast and Straightforward Implementation of Serial Interfaces 36 Lowering the barriers to IoT application development 38 Solid-state batteries for wearable sensors and electric cars 42 Isolated inputs are the key 48 Better energy-efficient flow rate regulation 52 Direct Connection onto the PCB 56 Navigating a sea of change for better marine connectivity 60 Analog IC Market Forecast With Strongest Annual Growth Through 2022

20

22

30

62 OUT OF THE BOX 64 NEW PRODUCTS 78 INDEX

32

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LatestNews Samsung Starts Producing 8-Gigabyte High Bandwidth Memory-2 with Highest Data Transmission Speed

system performance by as much as 50 percent, compared to a system that uses a 1.6Gbps HBM2. Samsung’s new Aquabolt significantly extends the company’s leadership in driving the growth of the premium DRAM market. Moreover, Samsung will continue to offer leading-edge HBM2 solutions,

Samsung Electronics, the world leader in advanced memory technology, today announced that it has started mass production of its 2nd-generation 8-gigabyte (GB) High Bandwidth Memory-2 (HBM2) with the fastest data transmission speed on the market today. The new solution, Aquabolt™, which is the industry’s first HBM2 to deliver

to succeed its 1st-generation HBM2, Flarebolt™, and its 2nd-generation, Aquabolt, as it further expands the market over the next several years. To achieve Aquabolt’s unprecedented performance, Samsung has applied new technologies related to TSV design and thermal control. A single 8GB HBM2 package consists of eight 8Gb HBM2 dies, which are vertically interconnected using over 5,000 TSVs (Through Silicon Via’s) per die. While using so many TSVs can cause collateral clock skew, Samsung succeeded in minimizing the skew to a very modest level and significantly enhancing chip performance in the process. In addition, Samsung increased the number of thermal bumps between the HBM2 dies, which enables stronger thermal control in each package. Also, the new HBM2 includes an additional protective layer at the bottom, which increases the package’s overall physical strength. In accommodating the growing need for high-performance HBM2 DRAM, Samsung will supply Aquabolt to its global IT customers at a stable pace, and continue to rapidly advance its memory technology in conjunction with leading OEMs throughout a wide array of fields including supercomputing, artificial intelligence, and graphics processing.

a 2.4 gigabits-per-second (Gbps) data transfer speed per pin, should accelerate the expansion of supercomputing and the graphics card market. “With our production of the first 2.4Gbps 8GB HBM2, we are further strengthening our technology leadership and market competitiveness,” said Jaesoo Han, executive vice president, Memory Sales & Marketing team at Samsung Electronics. “We will continue to reinforce our command of the DRAM market by assuring a stable supply of HBM2 worldwide, in accordance with the timing of anticipated next-generation system launches by our customers.” Samsung’s new 8GB HBM2 delivers the highest level of DRAM performance, featuring a 2.4Gbps pin speed at 1.2V, which translates into a performance upgrade of nearly 50 percent per each package, compared to the company’s 1st- generation 8GB HBM2 package with its 1.6Gbps pin speed at 1.2V and 2.0Gbps at 1.35V. With these improvements, a single Samsung 8GB HBM2 package will offer a 307 gigabytes-per-second (GBps) data bandwidth, achieving 9.6 times faster data transmission than an 8 gigabit (Gb) GDDR5 chip, which provides a 32GBps data bandwidth.* Using four of the new HBM2 packages in a system will enable a 1.2 terabytes-per- second (TBps) bandwidth., which will improve overall

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HARMAN and Samsung Unveil the Future of Connectivity and Autonomous Driving at CES 2018

technologies and global scale to accelerate how we better serve the needs of automakers in this rapidly evolving automotive market.” New HARMAN Digital Cockpit Platform The new Digital Cockpit platform includes a suite of flexible and scalable premium experiences that support today’s connected lifestyles

HARMAN and Samsung alliance integrates technologies in software, hardware and the cloud to become architects of experience, delivering future mobility and connected lifestyles It hasn’t been a year since HARMAN International became a wholly-owned subsidiary of Samsung Electronics focused on connected technologies for automotive, consumer and enterprise markets, and the two companies have

without compromising safety or performance. It’s available in standard and advanced system configurations and can seamlessly integrate the instrument cluster with center console via voice, haptic feedback, and physical knobs and steering wheel controls in a single, center screen for all vital vehicle information and features. This also supports a multi- modal approach for interactions with different human-machine interfaces to allow customization in terms of HVAC, media and user settings. The Digital Cockpit platform brings an entirely new generation of communication and ergonomics inside vehicles, allowing drivers to focus on the road ahead while intuitively and safely interacting with their in-car technology. This is made possible through a projection mode for services and apps via a user’s smartphone, allowing for increased personalization. A greater IoT ecosystem via cloud technology in the entry-level segment, as well as mid/high-level configurations, not only improves connectivity, but helps lower costs and overall vehicle weight. In a premium configuration, the Digital Cockpit weaves together a driver’s entire connected lifestyle across the Internet of Things. Through a multi-display layout that leverages HARMAN’s Ignite Platform, the in-car user experience can be personalized for the driver and passenger via services such as virtual personal assistants, portable profiles, augmented reality and more. This also allows for the Android OS to be integrated on four displays – a first for the industry. Focused on a future generation of shared mobility, the premium Digital Cockpit personalizes occupant experiences, so drivers and passengers feel like the car is theirs even if they don’t own it. By leveraging the phone as a key service, the system can automatically access subscription services associated with user profiles while Bixby offers intelligent personal assistance

already leveraged their combined teams and resources to drive future mobility forward. Unveiled today at CES 2018 are a host of unique connected car solutions that support HARMAN and Samsung’s joint mission to become the leader in connectivity and autonomous driving: connecting the lives of people, whether at home, on the go, or together in the car. These key innovations showcase an integrated approach to a rich digital car experience, including: A reinvented digital cockpit platform for all vehicle segments that has given the interior of the car a makeover; A new telematics solution along with the industry first automotive-grade 5G-ready connectivity solution; and An ecosystem of partners and solutions to further build out the Samsung open autonomous platform, along with a showcase of our first implementation of this together with TTTech. Each new solution was made possible through the HARMAN- Samsung alliance that leverages Samsung’s global scale, R&D capabilities, dominance in mobile/TV/semiconductors and distribution channels and HARMAN’s leading connected car heritage, relationships, market knowledge and growing community of innovation partners. Both companies are also making global investments in start-ups to help OEMs meet growing consumer demand for in-vehicle technology through scalable solutions that enhance the user experience for every vehicle segment. “Together with Samsung, we have increased innovation speed through scale, resources and competencies to help automakers focus on the car’s evolution from device-centric to experience centric,” said Dinesh Paliwal, HARMAN President and CEO. “HARMAN has the heritage and expertise in automotive, and collectively HARMAN and Samsung harness our best

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to help occupants complete tasks by voice, touch, gesture and context-based triggers. The Digital Cockpit is scalable and made available for every automotive segment, offering future proof and safety focused features within a developer-friendly open ecosystem. First 5G Automotive Telematics Solution and Customer HARMAN and Samsung are jointly developing modular approaches for advanced telematics, capable of 1 Gb/s bandwidth. HARMAN and Samsung will deliver the industry’s first 5G-ready automotive solution and multi-band conformal antenna to enable secure, fast and reliable data communications. The solution consists of a telematics control unit with a modular design accommodating a network access device (NAD) supporting LTE CAT 16 connectivity today and 5G in the future leveraging the same hardware design. 5G represents a paradigm shift in the future of mobility. In the automotive sector, 5G delivers safety-enhancing C-V2X capability that is an essential enabler for autonomous transportation. 5G boosts speeds up to 100X faster than current 4G LTE standards to provide incredibly fast high-resolution streaming, immersive virtual and augmented reality features and seamless cloud- based applications in fast-moving cars. Ultra-reliable and with low-latency response times of just 1ms, 5G enables C-V2X

graphene sensor that can be taped to plants – researchers have dubbed it a “plant tattoo sensor.” Graphene is a wonder material. It’s a carbon honeycomb just an atom thick, it’s great at conducting electricity and heat, and it’s strong and stable. The graphene-on-tape technology in this study has also been used to produce wearable strain and pressure sensors, including sensors built into a “smart glove” that measures hand movements. Researchers describe the various sensors and the “simple and versatile method for patterning and transferring graphene- based nanomaterials” to create the flexible sensors in a paper featured on the cover of the December 2017 issue of the journal Advanced Materials Technologies. The research has been primarily supported by the Faculty Advanced Driving Solutions Today for an Autonomous Tomorrow Developed in close collaboration with HARMAN, Samsung announced its new DRVLINE platform, an open and modular platform for autonomous driving designed to scale from Level 3 automation up to Levels 4 and 5. The two companies will continue to focus on engineering, high-performance computing, sensor technologies, algorithms, artificial intelligence, and cloud and connectivity solutions that are scalable and capable of lower-level autonomy through to Level 5. The first HARMAN/ Samsung-developed ADAS product will be a forward-facing camera featuring lane-departure warning, adaptive cruise control, collision warning and pedestrian warning algorithms. The new system combines Samsung’s heritage in camera technology with HARMAN’s ADAS 360 solution that blends machine learning and data science with augmented reality to create a self-learning virtual co-passenger to ensure the connected driving experience is personalized and safe. The new system will begin shipping in 2018. and cloud-based compute and storage for the next generation autonomous vehicles. HARMAN today announced that a leading European automaker will be the first customer for this solution. At CES 2018, HARMAN and Samsung will demonstrate high speed connectivity in a future mobility concept vehicle powered by the Samsung Networks 5G infrastructure.

Engineers make wearable sensors for plants, enabling measurements of water use in crops

Iowa State University plant scientist Patrick Schnable quickly described how he measured the time it takes for two kinds of corn plants to move water from their roots, to their lower leaves and then to their upper leaves. This was no technical, precise, poster talk. This was a researcher interested in working with new, low-cost,

easily produced, graphene-based, sensors-on-tape that can be attached to plants and can provide new kinds of data to researchers and farmers. “With a tool like this, we can begin to breed plants that are more efficient in using water,” he said. “That’s exciting. We couldn’t do this before. But, once we can measure something, we can begin to understand it.” The tool making these water measurements possible is a tiny

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The showing, a product of a multi-year collaboration, is the world’s first mass-market-ready 2nd-generation DSRC-based V2X solution. Featuring ST’s state-of-the-art Telemaco3 telematics platform and Autotalks’ CRATON2 chipset, which is the most advanced and secure V2X communication solution in the form of a commercial module, the demonstration will show how the now-commercially-ready technology can be used to avoid collisions, describe road conditions, and indicate distance to important infrastructure, such as EV charging stations. In the case of plant studies, the sensors are made with graphene oxide, a material very sensitive to water vapor. The presence of water vapor changes the conductivity of the material, and that can be quantified to accurately measure transpiration (the release of water vapor) from a leaf. The plant sensors have been successfully tested in lab and pilot field experiments, Dong said. A new three-year, $472,363 grant from the U.S. Department of Agriculture’s Agriculture and Food Research Initiative will support more field testing of water transport in corn plants. Michael Castellano, an Iowa State associate professor of agronomy and William T. Frankenberger Professor in Soil Science, will lead the project. Co-investigators include Dong and Schnable. The Iowa State University Research Foundation has applied for a patent on the sensor technology. The research foundation has also granted an option to commercialize the technology to EnGeniousAg – an Ames startup company co-founded by Dong, Schnable, Castellano and James Schnable, an assistant professor of agronomy and horticulture at the University of Nebraska-Lincoln, a collaborator on another Iowa State sensor project that sparked establishment of the company (and Patrick Schnable’s son). “The most exciting application of the tape-based sensors we’ve tested so far is the plant sensor,” Dong said. “The concept of wearable electronic sensors for plants is brand new. And the plant sensors are so tiny they can detect transpiration from plants, but they won’t affect plant growth or crop production.” But that’s not all the sensors can do. The technology could “open a new route” for a wide variety of applications, the authors wrote in their paper, including sensors for biomedical diagnostics, for checking the structural integrity of buildings, for monitoring the environment and, after appropriate modifications, for testing crops for diseases or pesticides.

Autotalks, the global leader in V2X (Vehicle to Everything) communication chipsets, and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, are working together to save lives and improve mobility on the roads through the use of DSRC (Dedicated Short Range Communication) -based Vehicle-to- Everything (V2X) communications technology. The partners will highlight both Vehicle-to-Vehicle (V2V) and Vehicle-to- Infrastructure (V2I) use cases during CES ® 2018 in Las Vegas. Scholars Program of Iowa State’s Plant Sciences Institute. Liang Dong, an Iowa State associate professor of electrical and computer engineering, is the lead author of the paper and developer of the technology. Seval Oren, a doctoral student in electrical and computer engineering, is a co-author who helped develop the sensor-fabrication technology. Co-authors who helped test applications of the sensors are Schnable, director of Iowa State’s Plant Sciences Institute, a Charles F. Curtiss Distinguished Professor in Agriculture and Life Sciences, the Iowa Corn Promotion Board Endowed Chair in Genetics and the Baker Scholar of Agricultural Entrepreneurship; and Halil Ceylan, a professor of civil, construction and environmental engineering. “We’re trying to make sensors that are cheaper and still high performing,” Dong said. To do that, the researchers have developed a process for fabricating intricate graphene patterns on tape. Dong said the first step is creating indented patterns on the surface of a polymer block, either with a molding process or with 3-D printing. Engineers apply a liquid graphene solution to the block, filling the indented patterns. They use tape to remove the excess graphene. Then they take another strip of tape to pull away the graphene patterns, creating a sensor on the tape. The process can produce precise patterns as small as 5 millionths of a meter wide – just a twentieth of the diameter of the average human hair. Dong said making the patterns so small increases the sensitivity of the sensors. (The process, for example, produced a detailed image of Iowa State’s Cyclone mascot that was less than 2 millimeters across. “I think this is probably the smallest Cyclone,” Dong said.) “This fabrication process is very simple,” Dong said. “You just use tape to manufacture these sensors. The cost is just cents.”

Autotalks and STMicroelectronics Show World’s First Mass- Market-Ready 2nd -Generation V2X Solution during CES 2018

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The DSRC-based technology today exceeds all existing US Department of Transportation (USDOT) specifications. “Using the technology we’re highlighting now, DSRC is ready for mass deployment with the ultimate goal of maximizing safety and mobility for both human-driven and autonomous vehicles,” said Hagai Zyss, CEO of

more connected,” said Fabio Marchió, General Manager, Microcontrollers and Infotainment Division, Automotive and Discrete Group, STMicroelectronics. “ST’s efforts have contributed to assuring the seamless integration of the CRATON2- based V2X module with ST’s advanced technologies for connected cars, including automotive secure processors, GNSS receivers, and sensors.“

Autotalks. “Our demonstration with ST is further evidence of the strong V2X ecosystem Autotalks has established in bringing next-generation automotive-qualified solutions to connected and autonomous vehicles today.” “The cooperation with Autotalks is a strong component in delivering on ST’s Smart Driving mission, which combines all of the elements to make automotive systems safer, greener, and

Two V2X showcases, one emphasizing the USDOT-compliant, commercially-ready DSRC-based solution and the other, a Virtual Reality experience that allows visitors to “drive” a V2X-equiped vehicle so they can see the technology’s benefits while “driving through” multiple common hazardous road scenarios, are on show by invitation-only. Please contact your ST representative to schedule a showing.

Mobileye and Spain’s Road Safety Authority DGT (Directorate-General of Traffic) Collaborate to Enhance Road Safety and Prepare for an Autonomous Future

driving. The DGT is working toward the regulation of autonomous vehicles and will lead the required cross- industry alliances to position Spain as an integrated Autonomous Ready™ country. In addition to assisting to prevent accidents by providing drivers with real-time visual and audio alerts, Mobileye 8 Connect™ collects

Collaboration Seeks to Enable Spanish Cities to Become Autonomous Ready through ADAS Adoption, Mapping Data Generation and Policy Framework Development Mobileye, an Intel Company, a global leader in the development of vision and data analysis for advanced driver assistance systems (ADAS) and autonomous driving, and Spain’s

actionable and dynamic data on city streets, such as infrastructure deficiencies, accident hotspots, parking usage, environment conditions and other road hazards. Data collected will be analyzed by the DGT and other government authorities to prepare Spanish roads for semi- and fully autonomous vehicles, while also contributing to and enhancing the development of Mobileye RoadBook™, powered by the crowdsourced REM Road Experience Management™ mapping technology. Additionally, data obtained will be utilized in other research and development projects to explore new ways to improve road safety. Mobileye and Spain’s DGT will also collaborate on

Directorate General of Traffic (DGT) today announced they have agreed to a collaboration intended to reduce road accidents and prepare Spain’s infrastructure ecosystem and regulatory policy for the driving of autonomous vehicles. As part of the agreement, Mobileye and the DGT will promote the benefits of the adoption of ADAS for municipal and private fleets to support improved road safety across Spain. The collaboration to promote adoption will include joint research to determine the magnitude of safety improvement driven by the performance and accuracy of Mobileye 8 Connect™. Furthering the Vision Zero objective, the DGT will also promote the development and adoption of autonomous

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defining the regulatory roadmap required for an autonomous future. Together they will seek to develop a policy framework for efficiently validating the safety of an autonomous vehicle, incorporating Mobileye’s Responsibility Sensitive Safety (RSS) model, which provides specific and measurable parameters to ensure that a self-driving vehicle operates in a responsible manner and does not cause accidents for which it can be blamed. “The visionary leadership within Spain’s DGT is working diligently to ensure the country is prepared for the arrival of autonomous vehicles, and we are honored to be a trusted partner of theirs in this endeavor,” said Gil Ayalon, director – EMEA, Aftermarket, Mobileye. “We at Mobileye commend the department for their innovative and bold approach to designing the future of transportation in Spain.”

recognition improves social situations. Identification of consumer products, colors and money notes provides a refreshing level of independence. Magnetically mounted on the wearer’s eyeglasses or sunglasses frame and weighing less than an ounce, OrCam MyEye 2.0 is the only wearable artificial vision tech that is activated by an intuitive pointing gesture or simply by following the wearer’s gaze – allowing for hands-free use without the need of a smartphone or Wi-Fi. ON Semiconductor is at the forefront of wearable and AR (Augmented Reality) devices, offering a wide range of Image Sensors and power conditioning devices that operate at extreme low power and the highest efficiency levels. Used in OrCam MyEye 2.0, the ON Semiconductor AR1337 13MP CMOS image sensor provides low- power operation and a fast focus technology, both key to extending the operational range of the OrCam assistive technology device. “We are proud to collaborate with OrCam in the development of a cutting-edge device which truly impacts the quality of life of people who have vision impairment and reading difficulties,” said Gianluca Colli, Vice President of the Consumer Business for the Image Sensor group. “We have integrated key low power operation modes that allow use in wearable devices where Edge AI technologies can fundamentally change capabilities of these products. The AR1337 is part of a family of low power, high resolution sensors that bring the best image quality into small form factor designs.” “This collaboration allows us to better understand and place Spain in a leading position for the major changes and opportunities that we are facing in road safety and mobility,” said Jaime Moreno, deputy director for Mobility Management, Directorate-General of Traffic. The landmark collaboration is the latest example of Spain’s efforts to become a world leader in road safety through technological innovation, and builds on Mobileye’s growing presence in the country. As part of Mobileye’s goal of developing autonomous vehicle technology that can be deployed anywhere, the company plans to test and train Level 4 SAE vehicles in varying locations around the world, including Spain.

Artificial Vision Revolution at CES: OrCam Next Generation Assistive Technology Optimized by ON Semiconductor Image Sensors

reakthrough OrCam MyEye 2.0 wearable device empowers people who are blind, partially sighted, and have reading difficulties OrCam Technologies, the world’s most advanced wearable artificial vision innovator for people who are partially sighted, blind, have reading difficulties or reading fatigue, will demo the newly-released, next generation OrCam MyEye 2.0 assistive technology device

throughout CES 2018. OrCam MyEye 2.0’s real-time communication of visual information is further enhanced by the power-efficient, fast-focused technology of ON Semiconductor, a company dedicated to driving energy efficient innovations. OrCam MyEye 2.0 is the culmination of intense research and development by leading minds in the Computer Vision and Machine Learning fields. “OrCam MyEye 2.0’s highly advanced artificial vision technology delivers increased independence in real time, by discreetly communicating text, faces and other visual information to the wearer of the device,” said Dr. Yonatan Wexler, Executive Vice President of Research & Development. “OrCam MyEye 2.0 empowers people who are blind or have low vision to successfully study, work and perform daily activities – with the ease of the most intuitive user interface.” Wireless, lightweight and compacted into the size of a finger, OrCam MyEye 2.0’s breakthrough assistive technology instantly reads printed and digital text aloud: newspapers, books, restaurant menus, signs, product labels, and computer and smartphone screens. Instant face

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Fabless IC Company Sales Top $100 Billion for First Time Ever

In 2015, for only the second time on record, IDM IC sales “growth” (-1%) outpaced fabless IC company sales “growth” (-3%). The primary cause of the fabless companies’ 2015 sales decline was Qualcomm’s steep 17% drop in sales. Much of the sharp decline in Qualcomm’s sales that year was driven by Samsung’s increased use of its internally developed Exynos

Two Chinese companies—HiSilicon and Unigroup—are among the top 10 fabless IC sales leaders. IC Insights is currently researching and writing its 21st edition of The McClean Report, which will be released later this month. As part of the report, a listing of the 2017 top 50 fabless IC suppliers will be presented. Unlike the relatively close annual market

application processors in its smartphones instead of the application processors it had previously sourced from Qualcomm. Although Qualcomm’s sales continued to decline in 2016, the fabless companies’ sales in total (5%) once again outpaced the growth from IDM’s (3%). In 2017, the market behaved very similarly to 2010, when strong growth in the memory market propelled the IDM IC sales growth rate higher than the fabless IC supplier growth rate. With the total memory market, a market in which the fabless IC companies have very little share, surging by 58% last year, IDM IC sales growth easily outpaced fabless company IC sales growth in 2017.

growth relationship between fabless IC suppliers and foundries, fabless IC company sales growth versus IDM (integrated device manufacturers) IC supplier growth has typically been very different (Figure 2). The first time IDM IC sales growth outpaced fabless IC company sales growth was in 2010 when IDM IC sales grew 35% and fabless IC company sales grew 29%. Since very few fabless semiconductor suppliers participate in the memory market, the fabless suppliers did not receive much of a boost from the surging DRAM and NAND flash memory markets in 2010, which grew 75% and 44%, respectively. However, the fabless IC suppliers once again began growing faster than the IDMs beginning in 2011 and this trend continued through 2014.

Gemalto launches the first biometric EMV card for contactless payments

Gemalto (Euronext NL0000400653 GTO), the world leader in digital security, has been selected by Bank of Cyprus to supply the world’s first EMV biometric dual interface payment card for both chip and contactless payments. Using fingerprint recognition instead of a PIN code to authenticate the cardholder, the card is compatible with existing payment terminals already installed in the country. When customers place their

A biometric solution and enrolment process designed to ensure optimal user privacy Gemalto’s biometric sensor payment card is based on the principle that biometric data should always remain in the hands of end users. Bank of Cyprus’ customers will complete the swift enrolment process at the bank’s branches, using Gemalto’s tablet

fingerprint on the sensor, a comparison is performed between the scanned fingerprint and the reference biometric data securely stored in the card. The biometric sensor card is powered by the payment terminal and does not require an embedded battery; this means there is no limit from battery life nor on the number of transactions.

designed for the solution. The biometric personalization and card activation process is designed to avoid transmission of biometric data over the air to ensure that users’ data privacy is protected. The fingerprint template captured during the enrolment process is stored only on the card. “Bank of Cyprus customers will be first in the world to enjoy

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biometric convenience on a contactless payment card. Gemalto’s biometric sensor payment card is designed to provide maximum security and data privacy” said Bertrand Knopf, Gemalto’s executive vice president Banking and Payment. “Using biometrics for contactless payments is a natural move as it fits in naturally with the gesture used to pay. It allows a better user experience, enabling higher transaction amounts without entering a PIN while benefiting from the convenience of contactless” “In order to bring seamless authentication to the banking sector, Gemalto has leveraged its extensive expertise from secure government documents and leadership in biometric applications”, said Stelios Trachonitis, Card Centre Manager from BOC “Our customers will benefit from this innovative payment solution with the peace of mind that their biometric data never leaves their hands” AFRL, American Semiconductor create flexible system-on- chip for ‘internet-of-things

A collaboration between the Air Force Research Laboratory and American Semiconductor has produced a flexible silicon-on-polymer chip with more than 7,000 times the memory capability of any current flexible integrated circuit on the market today. The manufacturing takes advantage of flexible hybrid electronics, integrating traditional manufacturing

thinned them until they became flexible but were still able tomaintain circuit functionality. This now allows us to place the microcontrollers— essentially minicomputers—in places we couldn’t before.” Instead of the big, bulky chips of the past, the new microcontrollers are able to bend and flex. This allows

them to integrate on systems such as wearable devices for hydration and fatigue monitoring and in soft robotics for wounded warfighters or the elderly. “This helps bring things like wearable sensors into the ‘internet-of-things.’ Now you can monitor things like hydration levels, temperature, strain from an arm flexing, and more,” said Berrigan. Unique to this effort, he continued, is not only is the new chip flexible, but it is actually a microcontroller with an onboard memory, able to both control a system as well as collect data for future analysis. The most complex, flexible integrated circuit ever produced, it has a memory more than 7,000 times larger than any other commercially available device. “It’s capable of turning a system on and off, and it can also collect data from a sensor and retain it in memory,” said Berrigan. “We can wrap this type of chip around a fuel bladder sensor to detect leaks, use it to monitor munitions inventory and even augment cold-chain monitoring through temperature sensing. Enhancing logistics is just one of many ways this effort can help meet Air Force needs.” Another benefit of the new microcontroller, according

techniques with 3D electronic printing to create thin, flexible semiconductors that can augment efforts in wearable technology, asset monitoring, logistics and more. As the ecosystem of everyday objects embedded with technology to connect, communicate and transfer information continues to expand, scientists are challenged to find ways to enable even more physical objects to become ‘smarter’ and connected. Leveraging the U.S. silicon manufacturing industry’s expertise in rigid electronics and novel efforts in high- performance electronics 3D printing, a collaborative effort between the Air Force Research Laboratory and American Semiconductor has resulted in a new flexible silicon-on- polymer chip that combines the best of the old and new to augment new networked realities. “Typical silicon-based, integrated circuits are brittle, rigid components that are packaged in a way that protects them. When we look at putting these type of devices into a flexible form factor, rigidness works against us,” said Dr. Dan Berrigan, a research scientist at the AFRL Materials and Manufacturing Directorate. “Working with American Semiconductor, we took silicon integrated circuit chips and

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to Berrigan, is that it is helping the U.S. silicon manufacturing base to evolve to meet future needs. “Whereas the European industrial base is focused on printing all parts of these types of devices, we are helping the U.S. silicon manufacturing community to convert to flexible capabilities and integrating this with low cost, 3D printed electronic circuitry,” said Berrigan. “This is a unique U.S. manufacturing capability.”

The flexible system-on-chip received the “Best New Material or Component Development Award” in the Wearable Technology Category at the 2017 IDTechEx Show, distinguishing it as a significant development for enabling wearable technology devices. IDTechEX is one of the largest tradeshows focused on innovation and technology and brings in cutting edge research and subject matter experts from all over the globe.

Arrow Accelerates IoT Leadership Position with eInfochips Acquisition

Arrow Electronics, Inc. announced today that it has signed a definitive agreement to acquire eInfochips, one of the world’s largest design and managed services companies. eInfochips works with global Fortune 1000 companies at every phase of technology deployment, including developing custom hardware and software and new IoT-based business models.

eInfochips’ IoT capabilities and engineers to our eDesign platform will substantially augment the scale of eInfochips’ services, delivered via digital tools, to Arrow’s 125,000 customers.” eInfochips is headquartered in San Jose, Calif., with locations in India and Europe, and 1,500 employees globally. eInfochips’ breadth of capabilities spans chip

eInfochips will expand Arrow’s IoT “sensor-to-sunset” platform by adding engineering, solution architecture, embedded software development, security, mobile device connectivity, app development, cloud configuration and management, and managed services including big-data analytics. “Upon close of this acquisition, eInfochips advances our IoT strategy, expands our offerings, and moves us into the rapidly growing IoT services market. As a result, we will deliver complex and connected IoT solutions and technologies across multiple cloud platforms,” said Michael J. Long, chairman, president, and chief executive officer of Arrow. “This acquisition adds over 1,500 IoT solution architects, engineers, and software development resources to Arrow’s already leading position in IoT design services.” “Arrow has redefined design engineering with our industry- leading eDesign digital platform. Customers now collaborate on Arrow.com with hundreds of online-enabled engineers. Our engineers help customers with online reference designs, cloud-based design tools, and our eDesign platform,” said Matt Anderson, chief digital officer of Arrow. “Connecting

design, to product and IoT solution delivery, and across many industries, from retail and consumer, to industrial automation, healthcare, and aerospace. The transaction is expected to close this month. Arrow Electronics (www.arrow.com) is a global provider of products, services and solutions to industrial and commercial users of electronic components and enterprise computing solutions. Arrow serves as a supply channel partner for more than 125,000 original equipment manufacturers, contract manufacturers and commercial customers through a global network of more than 465 locations in 90 countries. Safe Harbor The Private Securities Litigation Reform Act of 1995 provides a “safe harbor” for forward-looking statements. This press release includes forward-looking statements that are subject to numerous assumptions, risks and uncertainties that could cause actual results or facts to differ materially from such statements for a variety of reasons, including, but not limited to: our ability to expand our capabilities and offerings; our ability to deliver more and enhanced

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solutions; our ability to retain eInfochips’ employees; our ability to maintain and grow eInfochips’ sales and profits; and the other risks described from time to time in the company’s reports to the Securities and Exchange Commission (including the company’s Annual Report on Form 10-K and Quarterly Reports on Form 10-Q). Forward- looking statements are those statements which are not statements of historical fact. Forward-looking statements

can be identified by forward-looking words such as “expects,” “anticipates,” “intends,” “plans,” “may,” “will,” “believes,” “seeks,” “estimates,” and similar expressions. Shareholders and other readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date on which they are made. The company undertakes no obligation to update publicly or revise any of the forward-looking statements.

Manchester scientists develop graphene sensors that could revolutionise the Internet of Things

Theexcitement doesnot endwith this new application here, but leads to the future possibilities of integrations of this technique with other 2D materials to open up a new horizon of wireless sensing applications. Dr Zhirun Hu The developed technique has the potential to simplify how the

Researchers at The University of Manchester have devised graphene sensors embedded into RFIDs, which have the potential to revolutionise the Internet of Things (IoT). By layering graphene-oxide (a derivative of graphene) over graphene to create a flexible heterostructure the team have developed humidity sensors for remote sensing with the ability to connect to any wireless network.

information is gathered through its wireless system, nor is it is limited to a particular wireless network and has the ability to be compatible with networks including WiFi and 5G. Dr Zhirun Hu who led the work said: The excitement does not end with this new application here, but leads to the future possibilities of integrations of this technique with other 2D materials to open up a new horizon of wireless sensing applications. Professor Sir Kostya Novoselov, who won the Nobel Prize in Physics and coordinated the project, added: It is the first example of the printable technology where several 2D materials come together to create a functional device immediately suitable for industrial applications. The Internet of Things is the fast growing segment of technology, and I’m sure that 2D materials will play an important role there. Advanced materials is one of The University of Manchester’s research beacons – examples of pioneering discoveries, interdisciplinary collaboration and cross-sector partnerships that are tackling some of the biggest questions facing the planet.

Graphene was the world’s first two-dimensional material isolated in 2004 at The University of Manchester, it is stronger than steel, lightweight, flexible and more conductive than copper. Since then a whole family of other 2D materials have been discovered and continues to grow. Using graphene and other 2D materials, scientists can layer these materials, similar to stacking bricks of Lego in a precisely chosen sequence known as van der Waals heterostructures to create high-performance structures tailored to a specific purpose. As reported in Scientific Reports, the groundbreaking nature of this development is that such sensors can be printed layer-by- layer for scalable and mass production at very low cost. The device also requires no battery source as it harvests power from the receiver. Sensors with a RFID enabler are at the heart of the IoT. This new development can provide various applications such as battery-free smart wireless monitoring for manufacturing processes that are sensitive to moisture, food safety, healthcare and nuclear waste.

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CES 2018: Catalyst of Innovation 5G, smart cities, AI, IoT, AR and VR, shine at annual innovation event

New-Tech Magazine

CES ® 2018 officially wrapped, after dazzling the world with a glimpse into the future. More than 3,900 exhibitors showcased world-changing technologies that spanned more than 2.75 million net square feet of exhibit space across Las Vegas – the largest show floor in CES’ 51 year history. There were 860,732 tweets about CES 2018 and 450,554 uses of the #CES2018 hashtag. From major international brands to the more than 900 startups participating in Eureka Park (home for CES startups) CES 2018 truly reflected the vibrant global tech industry. “Large and small companies from around the globe came to Las Vegas this week to use CES 2018 to launch technologies that will change our world,” said Gary Shapiro, president

and CEO, Consumer Technology Association (CTA). “From 5G to smart cities, digital health, AI, VR/AR and more, the technologies that will shape the future of our planet and lives for the better were on display across the show floor. CES is the global platform where you can see the critical ingredient technologies and understand better how they interconnect, providing both a clear snapshot of today’s breakthrough innovations and a vision of the road ahead.” Intel, Ford and Huawei took the CES 2018 keynote stage this week with corporate showcases. Intel’s preshow keynote involved a grand production with technology advances and creative artistry that rivaled top Las Vegas shows. Throughout the extravaganza,

Intel celebrated innovation, explored what’s next for big data and set a Guinness World Record with its Shooting Star Mini Drone show – the most advanced software fleet of 100 drones controlled without GPS by one pilot. Ford’s opening keynote focused on creating a reliable future of transportation through a systems- based approach for smart cities. Huawei announced the availability of its Mate10 Pro smartphone in the American market next month during its Tuesday afternoon keynote. “With every major industry now engaged in tech, our show attracts major global brands and innovative newcomers from industries as varied as entertainment and marketing, sports and healthcare, and automotive and lifestyle” said

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Karen Chupka, senior vice president, CES and corporate business strategy, CTA. “We had a record number of international attendees, which is amazing due to the strength of the US dollar and the drop in international business travel to the US. CES is truly a global event, proven year after year." An array of groundbreaking technologies were introduced, explored and analyzed over the past days, showing that our world is heading towards a more connected future. Smart Cities at CES spotlighted many of these innovative technologies, including 5G, AI and IoT. The CES conference program covered the entire tech industry through more than 900 speakers, including 240 women, across some 200 conference sessions. “CES 2018 will be remembered as the year where the wattage of innovation was so huge that it caused a blackout!” said Bridget Karlin, CTO and VP, IBM. “CES 2018 once again demonstrated that this is the world’s premiere showcase for technology innovation with unparalleled diversity from international public officials to industry leaders to entrepreneurs.” The brand new Smart Cities Marketplace delivered multiple conference sessions that featured policymakers, city officials, industry innovators and more. Additionally, CES 2018 saw several hundred government leaders attend the show including one cabinet official, 10 members of congress and six international ministers. Smart speakers and digital assistants

made their way into everything at CES from speakers and glasses to cars and appliances. Quantum computing also emerged at CES 2018 as a key component to the future of technology, showcased by exhibitors like IBM and Intel. “CES is by far the world’s preeminent technology showcase and innovation catalyst. At CES, companies, both large and small,

along with a powerfully diverse set of entrepreneurs from around the globe come together to define the technologies, products and services that will help address society’s most pressing needs,” said John Penny, EVP, consumer business development & partnership, Twentieth Century Fox. “CES is a connection system for the global community of innovations, their companies, and countries.”

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