New-Tech Europe Magazine | January 2019

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Marketing Manager in the Integrated Optical Sensors business line of ams. “The TMF8701 addresses all of these concerns, providing customers with a device in a smaller footprint which also offers exceptional rejection of contamination and interference.” The TMF8701 integrates a VCSEL infrared emitter, multiple SPAD (single photon avalanche photodiode) light detectors, time-to-digital converter, and a histogram processing core. The device implements all histogram-based presence detection, distance measurement and proximity sensing algorithms on- chip. The TMF8701 separately identifies reflections from fingerprint smudge contaminations on the display screen and optical reflections from objects beyond the cover glass, such as the user’s face, maintaining reliable performance even when the sensor’s aperture is dirty. The Class 1 Eye Safe VCSEL emitter has excellent immunity to interference from ambient light and produces accurate distance measurement in all lighting conditions: the module achieves accuracy of ±5% when measuring distance in the range 20-60cm in normal lighting conditions. Even in bright sunlight (100klux), ±5% accuracy is maintained at a range of up to 35cm. The low-power operation of the TMF8701 – it draws only 940µA in proximity sensing mode when sampling at 10Hz – makes it the ideal companion to a smartphone’s face recognition system. Always on, it triggers the higher-power face recognition system to start up when the ToF sensor detects the presence of an object up to 60cm from the display screen. The proximity sensing capability of the device can also be used to trigger the display and face recognition system to switch off when detecting a reflective surface at a distance of 0-10cm from the screen. The accuracy of the TMF8701’s distance measurements also supports the selfie camera’s LDAF (laser detect auto-focus) function, especially in low-light conditions. The TMF8701 time-of-flight sensor is in mass production now. Unit pricing is $2.60 in an order quantity of 5,000 units. An evaluation kit for the TMF8701 is available. For sample requests and more technical information, go to www.ams.com/TMF8701.

NXP Brings Dolby Atmos® and DTS:X® to the Masses with its New Immersiv3D Audio Solution NXP Semiconductors N.V. unveiled Immersiv3D audio solution for the smart home market, igniting a new era of audio system design and development. The solution combines ground-breaking NXP software on its i.MX 8M Mini applications processor and will support both Dolby Atmos® and DTS:X® immersive audio technologies in future devices that integrate the i.MX 8M Mini SoC. The i.MX 8M Mini also brings smart capabilities like voice control to a broader range of consumer devices including soundbars, smart speakers, and AV receivers with the option for adding additional speakers to distribute smart voice control and immersive audio throughout the home. Delivering the Quality of Dolby Atmos and DTS:X Like many devices in the home, TVs and audio systems are also becoming more advanced; specifically sound — has been progressing by leaps and bounds in recent years, thanks in large part to the development of Dolby Atmos and DTS:X. Both technologies are a leap forward from surround sound and transport listeners with moving audio that fills the room and flows all around them. Listeners will feel like they’re inside the action as the sounds of people, places, things, and music come alive with breathtaking realism. The new Immersiv3D audio solution was designed to enable Original Equipment Manufacturers (OEMs) to bring to market affordable consumer audio devices capable of supporting Dolby Atmos and DTS:X in their next-generation devices. “Dolby Atmos takes your favorite entertainment to the next level with breathtaking immersive audio,” said Mahesh Balakrishnan, Vice President, Enhanced Audio Experiences, Dolby Laboratories. “With Dolby Atmos supported on NXP’s Immersiv3D audio solution, we are

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