New-Tech Europe Magazine | June 2018

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NXP Introduces New High Power RF Products for 5G Networks Semiconductors N.V. is driving innovation with its expanded cellular infrastructure portfolio of GaN and silicon laterally diffused metal oxide semiconductor (Si-LDMOS) products that deliver industry leading performance in a compact footprint to enable next- generation 5G cellular networks. Spectrum expansion, higher order modulation, carrier aggregation, full dimension beam forming, and other enablers of 5G connectivity will require an expanded base of technologies to support enhanced mobile broadband connectivity. With spectrum usage and network footprints, multiple-input, multiple output (MIMO) technologies from four transmit (4TX) antennas to 64 TX and higher will be employed. The future of 5G networks will depend on GaN and Si-LDMOS technologies and NXP is at the forefront in its RF power amplifier development. “Building on the success of 25 years of LDMOS leadership — NXP released the world’s first LDMOS product in 1992 — today, we are extending our RF leadership with industry leading GaN technology, developed with the highest linear efficiency for cellular applications,” said Paul Hart, senior vice president and general manager of NXP’s RF Power business. “Backed with the best supply chain, global applications support and unparalleled design expertise in the industry, NXP is positioned to be the leading RF partner for 5G solutions.” At IMS 2018, NXP is introducing new RF GaN wideband power transistors and expanding its Airfast third- generation Si-LDMOS portfolio of macro and outdoor small cell solutions.

Harwin Expands Breadth of Robust Surface Mount 3-Point PCB Socket Series High-reliability connector supplier Harwin has announced further additions to its Sycamore Contact product offering. While this series was initially capable of accommodating 1mm and 1.5mm diameter contact pins, it now covers pin sizes from 0.80 to 1.90mm. There are a wide variety of scenarios where electronic devices/modules will require replacement over time (such as depleted gas sensors or worn-out energy harvesting transducers). In addition, initial exposure of these modules to soldering temperatures can introduce the risk of early failure due to heat damage. Both these risks show that direct soldering onto the PCB is clearly unadvisable. Removal of a failed or damaged module will prove difficult, and could result in scrappage of the whole board. The Sycamore Contact series of surface mount PCB sockets allow odd-form devices/modules that are not suited to regularly-spaced socket strip arrangements to be attached without any future inconvenience, should removal be required at a later stage. Whereas other contact solutions of this kind only comprise 2 points of contact to the mating pin, making them vulnerable to exposure from vibrational forces, the patent pending design of the Sycamore Contact gives engineers access to 3 contact points. This markedly improves operational stability, as well as delivering stronger pin retention and heightened levels of signal integrity. Available in both top-entry and bottom-entry configurations, these sockets have a current rating of 6A and a 15mΩ (maximum) contact resistance. Their sturdy construction, which uses beryllium copper with gold plating, means that they support 500 mating cycles and exhibit an operational temperature range spanning from -50°C to +125°C. As these components can be supplied in a tape-and-reel format, they are highly suited to automated production processes, with the surface mount placement feet also serving as the pickup areas for pick-and place machinery.

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