New-Tech Europe Magazine | March 2018

C Components Electro Optic & Camera Packaging & Producti

New Products Automotive

IoT

IoT Computers Components Computers Electro Optic & Camera Packaging & Production Motion Automotive New Products ACEPACK 1 or larger ACEPACK 2 sizes, featuring either 650V or 1200V IGBTs and current ratings from 15A to 75A. The internal layout of the modules is optimized for low stray inductance and low EMI emissions, which simplifies meeting EMC regulations, and 2.5kV isolation ensures robust performance under harsh operating conditions. All modules are specified up to 175°C maximum operating temperature, giving designers extra freedom to optimize heatsink size and power dissipation.

Automotive

New Products

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Computers Communication

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Communication

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thereby enabling high density designs to be realized for USB PD. The NCP51530 drivers are a high-speed, high-performance robust power solution that includes the option of AEC Q-100 qualification for automotive applications.”

New ACEPACK™ Power Modules from STMicroelectronics Deliver Advanced Performance and Economy STMicroelectronics’ new ACEPACK™ (Adaptable Compact Easier PACKage) modules provide cost- effective and highly integrated power conversion for 3-30 kW applications including industrial motor drives, air conditioners, solar generators, welders, battery chargers, UPS controllers, and electric vehicles. ST’s space-efficient, low-profile ACEPACK technology combines high power density with reliability in economical plastic package. Features include optional solder-free press-fit connections, which simplify assembly as an alternative to conventional soldered pins, and metal screw clamps that enable fast and reliable mounting. Inside, ST’s third-generation field-stop trench IGBTs deliver today’s best combination of low on-resistance and high switching performance. Two configurations are available, giving a choice of sixpack modules that contain six IGBTs with freewheel diodes as a three- phase inverter, or Power Integrated Modules (PIM) that provide a complete driver power stage. The PIMs are Converter-Inverter-Brake (CIB) devices that integrate a three-phase rectifier, a three-phase inverter, and a braking chopper for handling energy returned from the load. Both types also contain an NTC thermistor for temperature sensing and control. Various PIM/CIB and sixpack devices are available in

Anritsu Announces Signal Analyzer MS2850A Selected by Samsung for 5G system development Anritsu Corporation announces Samsung Electronics Co., Ltd. selected its Signal Analyzer MS2850A with 5G analysis software installed to support 5G system developments. Samsung unveiled its end-to-end 5G product portfolios including 5G home routers (CPEs), 5G Access Unit (AU) last year under development for commercial grade products. The company is engaged with major operators in leading markets like the United States, South Korea and Japan to commercialize 5G to the market. Anritsu’s MS2850A will play a key quality assurance role at manufacturing to facilitate fast 5G service deployments. By partnering with Samsung in the mobile communications field since 3G (W-CDMA), Anritsu has long supported communications equipment development and manufacturing. As Samsung’s 5G measuring equipment vendor, Anritsu provides a measurement solution tailored to fast deployment of future 5G services.

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