New-Tech Europe Magazine | Q1 2020

Latest News

Nokia partners with IIiad Group to roll out 5G in France and Italy

Thomas Reynaud, IIiad Group’s CEO, said: “We want to offer our customers the best possible 5G experience and that is why we have chosen to strengthen and accelerate our relationship with Nokia as we enter the 5G era. Nokia’s innovative 5G technologies and

Nokia announced that it will extend its long-standing partnership with French mobile operator, IIiad Group, to roll out 5G networks across France and Italy. The 5G deal will focus on network modernization and 5G introduction in France and 5G introduction in Italy making 5G available to 17 million IIiad subscribers across both countries.

solutions will enable us to launch quickly and efficiently, delivering a superior network performance whilst also securing us against future challenges.” Tommi Uitto, President of Mobile Networks at Nokia, commented: “We are delighted to continue our long-standing relationship with IIiad to roll out 5G networks across France and Italy and build out a world-class network for businesses and consumers alike. The radio technologies will give Iliad the flexibility to quickly and smoothly launch a future-proof 5G network.”

Nokia has worked closely with IIiad Group in France since 2012 and in Italy since 2018 on the rollout of both 3G and 4G, now adding 5G networks to its portfolio. Iliad Group will install Nokia’s newest radio access technology, AirScale, allowing it to capitalize on early 5G networks whilst supporting 4G/LTE and 5G in the same radio access system. This versatility will enable IIiad Group to offer new services to both consumers and businesses while also future-proofing the radio network. The installation of 5G massive MIMO antennas will ensure Iliad subscribers can make the most of the ultra-low latency and high- bandwidth capabilities of 5G.

Up Close with Lakefield – Intel’s Chip with Award-Winning Foveros 3D Tech

The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake)

and match” technology IP blocks with various memory and I/O elements – all in a small physical package for significantly reduced board size. The first product designed this way is “Lakefield,” the Intel® Core™ processor with Intel hybrid technology.

Industry analyst firm The Linley Group recently named Intel’s Foveros 3D-stacking technology as “Best Technology” in its 2019 Analysts’ Choice Awards. “Our awards program not only recognizes excellence in chip

versus a chip with a more-traditional pancake-like design. Intel’s Foveros advanced packaging technology allows Intel to “mix

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