New-Tech Europe | March 2017 | Digital Edition

HIGH DENSITY ARRAYS

• (1,27 mm x 1,27 mm) .050" x .050" grid array for maximum grounding and routing flexibility • Up to 500 single-ended I/Os or 125 differential pairs (using Samtec recommended pin assignments) • Rugged Edge Rate® contact system less prone to damage when “zippered” to unmate • 0,80 mm pitch system for up to 50% board space saving • Right angle and low profile systems • Ultra high density, ultra-low profile compression arrays