New-Tech Europe | May 2017

Figure 1. Module technologies are being developed to achieve unprecedented integration and functionality within a smaller form factor.

toolbars can now also be distributed in PDKs to support highly customized design flows for leading front-end manufacturers. Embedding RFIC design in MCM simulations With MCMs, the off-chip design and simulation including embedded passives and laminate interconnects often require some representation of the RFIC device(s) for the overall module characterization. Module designers need a way to incorporate an accurate model for the RFIC (or critical portions of the RFIC design) within the circuit hierarchy that includes the laminate substrate. Advances in hierarchical design management, complemented with a new OpenAccess import/export wizard (supporting, for example, the import/export of RFIC schematics and project symbols from Cadence

facilitate designs based on specific manufacturing processes such as PCBs and multi-technology (mixed- technology) projects, commonly used to simulate multi-chip modules (MCM) that incorporate diverse MMIC and RFIC devices on a single laminate package/module. A process design kit (PDK) helps manage design entry with information that contains files for the device library (symbols, device parameters, PCells), technology data (layer stack ups), simulation models, verification deck, and more. PDKs are used by circuit designers to construct a simulation version of their product from these components made available through the fabrication process. In V13, PDK-specific improvements make it easier to install new PDKs and work with multiple layout process files (LPFs) typical of MCMs. Custom

At RF and microwave frequencies, electrical performance is directly influenced by physical design. Therefore, great care must be taken to ensure that a component’s physical attributes are fully incorporated into the simulation model and that the physical details used in simulation are fully and accurately replicated by the manufacturing process. V13 offers new and improved features that impact design layout and interoperability between NI AWR Design Environment and third- party IC and PCB electronic design automation (EDA) tools (Figure 2). These enhancements deliver key capabilities for design entry (both schematic and layout), parameterized circuits, systems, and EM subcircuits, design synthesis, simulation and optimization controls, and measurement graphs. Overall the improvements serve to better

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