New-Tech Europe | November 2016 | Digital edition

new products

Engineering samples of the 300 MHz lead device, the TC39xx, with 16 Mbyte of embedded Flash will be available in BGA-516 package and BGA-292. General sampling is scheduled to start in the first quarter of 2017. Qualification of the first product is planned in the first quarter of 2019.

The AURIX TC3xx family will be highly scalable and offer Flash memory sizes of up to 16 MByte and more than 6 MByte of integrated RAM. Compared to today’s AURIX TC2xx microcontrollers with up to three TriCore™ cores, the TC3xx multicore architecture provides up to six TriCore cores, each with a full clock frequency of 300 MHz. Four of the six cores feature an additional lockstep core enabling a new level of ISO 26262 functional safe computational power on a single integrated device: Up to 2400 DMIPS performance supporting applications classified ASIL-D, compared to up to 740 DMIPS with the previous AURIX architecture. The performance increase and the reuse of existing safety concepts allow automotive system suppliers to reduce development costs by 20 percent and improve time-to-market. Also, more functions can now be implemented on a single microcontroller, such as powertrain and chassis domain control and next generation radar and fusion algorithms. Automotive radar systems ranging from blindspot monitoring to advanced front radar specifically benefit from the capabilities of the AURIX TC3xx family. TC3xx microcontrollers will feature a radar processing sub- system with up to two dedicated Signal Processing Units running at 300 MHz enabling computation of next- generation radar algorithms on a single chip. In addition, radar chips can be seamlessly connected to AURIX via a high-speed digital radar interface. AURIX TC3xx does not compromise on security. A new version of the programmable Hardware Security Module (HSM) is available across the family: it supports to better secure on-board communications and to prevent hardware manipulation, such as motor tuning. New asymmetric cryptography accelerators are integrated into the HSM hardware that helps to achieve full EVITA support. TheAURIX TC3xx facilitates fast software-over- the-air updates to protect against software hijacking. As a host controller in gateway and telematics applications, AURIX TC3xx microcontrollers support the latest communications interfaces. They feature a Gigabit Ethernet interface, up to 12 CAN-FD channels compliant to ISO11898-1 and up to 24 LIN channels. An additional eMMC interface for external Flash interfacing enables local data storage supporting software-over- the-air update concepts. Availability The second generation AURIX TC3xx family is compatible with the previous AURIX TC2xx generation.

Industry First Intelligent Charge Controller from ON Semiconductor Meets the Exacting Demands of Next Generation Power Banks ON Semiconductor (Nasdaq: ON ), driving energy efficient innovations, has introduced a highly integrated single chip power bank solution for the development of next generation Li-Ion powered products. The LC709501F total Li-Ion battery solution offers broad power and voltage/current output range of 5 volt (V), 9 V and 12 V operation, with a maximum charge/discharge capability of up to 30 watts (W) through simple FET selection. The LC709501F determines what type of device is connected and automatically selects the fastest available method for charging. Advanced users can even reprogram the LC709501F to support custom charge/discharge profiles, as well as USB Type-C and PD Policy Engine functions. This single-chip solution includes integrated fuel gauge function, configurable I/O, LED drivers, I2C interface, and pre-drivers for external power MOSFETs, providing system flexibility. A design reference kit is available to realize fast time to market. The LC709501F supports various output power levels up to 30 W, by changing external MOSFETs. In addition, there is an integrated USB 2.0 Full Speed host controller. The LC709501F’s USB host controller supports

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