New-Tech Europe | Sep 2017 | Digital Edition

new products

new SLVS-EC interface: “Based on the different quality improvements, the existing standard interfaces would reach its limits transferring the high data volumes at faster speed. SONY has developed the SLVS- EC standard with 8 lanes. It answers the increasing demands in resolution and speed and doubles the maximum output to 18.4 Gbps compared to the second generation (9.5 Gbps).” The IMX420 sensor is equipped with four additional features: The High Conversion Gain (HCG) allows the acquisition of images with better quality under low light conditions. This is achieved by increasing the conversion gain of the pixels while keeping the noise contribution of the analog circuit constant. Conversely, the Low Conversion Gain mode (LCG) is used under bright illumination conditions, being realized by lowering the conversion gain of the pixel. Dual triggering allows the possibility of different exposure times and gains in different regions of interest, to obtain an individual and effective image acquisition pipeline by using of two external trigger signals. The Dual ADC can read each pixel with separate gains. By combining the two images off-the-sensor a high dynamic range image can be obtained. The self-trigger feature, detects a change in a the predefined “sensing area” and acquires an image automatically when this change passes a certain threshold. The IMX420 and IMX428, as the first sensor models featuring SONY’s 3rd generation CMOS Global Shutter mode, clearly show how the combination of high resolution and high frame rates, along with Global Shutter read-out technology boosts imaging quality and speed into new spheres. Mass production is scheduled around spring 2018, evaluation samples are now available at FRAMOS. Industry and product experts at FRAMOS are available to support customers with the integration of these new sensors in their applications and projects. In addition, FRAMOS also provides additional services like development support, customization, and logistics to customers.

CoolMOS™ P7 in SOT-223 combining performance and ease of use with a cost- effective package solution Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its recently launched CoolMOS™ P7 technology with a SOT-223 package. The device has been developed as a one-to-one drop-in replacement for DPAK. It is fully compatible with a typical DPAK footprint. The combination of the new CoolMOS P7 platform with the SOT-223 package is a perfect fit for applications such as charger for smartphones, laptop adapters, TV power supply, and lighting. The new CoolMOS P7 is designed to address needs of the low power SMPS market. It offers excellent performance and ease-of-use, allowing designers to take advantage of improved form factors. It uses a price competitive Superjunction technology, which results in a reduced overall Bill of Materials (BOM) on the customer side. The SOT-223 package is a cost-effective DPAK alternative and well established in price sensitive markets. The thermal behavior of the CoolMOS P7 in this package was assessed across several applications. When the SOT-223 was placed on a DPAK footprint, the temperature increased by a maximum of 2-3°C compared to a standard DPAK. With a size of the copper area of 20 mm² or more, the thermal performance was equal to DPAK.

Composite 38999 connectors from Aerco save weight without compromising performance Aerco, the distributor and stockist of electrical and electronic components servicing hi-rel markets, is now stocking TE Connectivity (TE)’s DEUTSCH MIL- DTL-38999 series next generation ACT composite connectors which deliver up to 40 percent weight

New-Tech Magazine Europe l 69