New-Tech Magazine | APR Edition - Special for New-Tech Exhibition 2025 | Digital Magazine

Co Components

New Products Automotive

IoT

Computers Components Computers Electro Optic & Camera Packaging & Production Motion Automotive New Products

Automotive

New Products

IoT

Electro Optic & Camera Packaging & Productio

Motion

Motion Automotive adjust to changing environmental conditions and optimize signal strength for maximum efficiency. With support for various frequency bands and flexible channel bandwidths, Ray3 provides versatility to suit diverse deployment scenarios. From urban deployments to remote installations, RACOM Ray3 Microwave Links provide the backbone for modern telecommunications networks, setting new standards for performance, reliability, and scalability. Experience the future of wireless connectivity with Ray3 and unlock the full potential of your network infrastructure. לפרטים נוספים: תל-עד אלקטרוניקה 054-5644820 | 09-7644315 elip@tel-ad.co.il https://tel-ad-systems.com Computers Communication

Motion

Communication

missions Satisfying mission assurance requirements for the most critical space programs, Microchip Technology’s )Nasdaq: MCHP( Radiation-Tolerant )RT( RTG4™ Field- Programmable Gate Arrays )FPGAs( with lead-free flip-chip bumps have earned the Qualified Manufacturers List )QML( Class V status. As designated by the Defense Logistics Agency )DLA(, QML Class V is the highest level of qualification for space components and a necessary step to satisfy mission assurance requirements on the most critical space missions such as human-rated, deep space and national security programs. Because QML qualifications are standardized based on specific performance and quality requirements governed by the DLA, customers can streamline their design and certification processes by using QML-qualified products. In 2018, RTG4 FPGAs became the first RT FPGAs offering more than 150,000 logic elements to achieve a QML Class V qualification, and this next-generation solution with lead free flip-chip bumps is the first of its kind to achieve QML Class V status. In advanced flip-chip package construction, such as that used in the RTG4 FPGA, flip-chip bumps are utilized to connect the silicon die and the package substrate. Lead

Racom Ray3 Point To Point microwave communication units work as a wireless Ethernet point-to-point link in a full duplex setting with transfer speeds of up to 10 Gb/s. The link is formed by two RAy units, each equipped by its own parabolic antenna and accessories to be fully operational. RACOM Ray3 Microwave Links redefine high-speed point-to-point connectivity with their exceptional performance and robust design. Engineered to excel in the most challenging conditions, Ray3 stands as the ultimate solution for Internet Service Providers )ISPs( and global Telco operators alike. Whether deployed for backbone infrastructure or bridging last-mile connections, Ray3 delivers unmatched reliability and speed, ensuring seamless data transmission in any environment. Technically, Ray3 incorporates state of-the-art microwave technology, offering high throughput rates and low latency, even over long distances. Its advanced modulation schemes and error correction mechanisms guarantee optimal performance, making it ideal for critical applications where reliability is paramount. Additionally, Ray3 boasts adaptive modulation and power control features, allowing it to dynamically

Microchip’s RTG4™ FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification QML Class V designation recognizes exceptional reliability and longevity for critical space

SAVE THE DATE 10.11.2025

Electronic Packaging, Electro Mechanical Solutions & 3D הכנס השנתי לזיווד אלקטרוני, אלקטרומכאניקה והדפסות תלת מימד

8:30-15:30 | 10.11.2025 | , אקספו, תל אביב 10 ביתן

97 l New-Tech Magazine