New-Tech Magazine - Europe | January Digital edition

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be inserted to perform at-speed programmable memory built-in self test (PMBIST) across multiple embedded memories in an IP core. New soft programmable test algorithms for FinFET SRAMs and automotive safety applications are also included with this feature. Powerful common scripting and debug environment: Design for test (DFT) logic insertion and ATPG capabilities use a new, unified Tcl scripting and debug environment that is shared with the Cadence Genus™ Synthesis Solution, the Innovus™ Implementation System and the Tempus™ Timing Signoff Solution. “Our next-generation Modus Test Solution delivers new, innovative patent-pending technology that fundamentally changes the way design and test engineers address the test problem,” said Dr. Anirudh Devgan, senior vice president and general manager of the Digital and Signoff Group at Cadence. “By using a physically aware approach in a 2D grid, and compressing patterns sequentially as well, the Modus Test Solution can significantly reduce digital test time in comparison to traditional approaches, thereby giving Cadence customers yet another significant profitability advantage.” For more information on the Modus Test Solution, please visit www. cadence.com/news/modus.

New Cadence Modus Test Solution Delivers Up to 3X Reduction in SoC Test Time Physically aware 2D Elastic Compression architecture reduces test logic wirelength by up to 2.6X and enables compression ratios to scale beyond 400X without impacting design size Cadence Design Systems, Inc. (NASDAQ: CDNS) todayannounced the new Modus™ Test Solution that enables design engineers to achieve an up to 3X reduction in test time, thereby reducing production test cost and increasing silicon profit margins. This next-generation test solution incorporates patent- pending, physically aware 2D Elastic Compression architecture that enables compression ratios beyond 400X without impacting design size or routing. To address the challenges that come with testing designs, the Cadence® Modus Test Solution includes the following innovative capabilities: 2D compression: Scan compression logic forms a physically aware two-dimensional grid across the chip floorplan, enabling higher compression ratios with reduced wirelength. At 100X compression ratios, wirelength for 2D compression can be up to 2.6X smaller than current industry scan compression architectures. Elastic compression: Registers embedded in the decompression logic enable fault coverage to be maintained at compression ratios beyond 400X by controlling care bits sequentially across multiple scan cycles during automatic test pattern generation (ATPG). Embedded memory bus support: A shared test access bus can

Samsung Launches New LED Module Lineup, inFlux, for High-Flux Industrial Lighting Samsung Electronics, a world leader in advanced components, introduced inFlux, a new lineup of high-flux (extremely bright), linear LED modules optimized for industrial lighting applications such as plants, parking lots and warehouses. The LED modules serve as a replacement for conventional T8 and T5HO (high output) tubes and are suitable for high-flux LED luminaires covering up to 40,000lm (luminous flux*). “By providing a wide variety of installation layout options and brightness intensities, our new inFlux linear module will deliver greater design flexibility and convenience for lighting designers, as well as high performance and reliability for fixture manufacturers,” said Jaewook Kwon, Vice President, Lighting Marketing Group, LED Business Team, Samsung Electronics. “We will continue to reinforce our well-differentiated LED lighting engine lineups to be able to meet more diverse market needs.” The Samsung inFlux LED module incorporates the company’s mid- power LED package (LM301A), which features advanced “flip chip” technology that enables a shorter junction-to-base distance and less thermal barrier layers in each package, while avoiding the need for metal wire bonding. This leads to lowering the thermal resistance of the packages, and permits each package to handle a wide range of current with improved light efficacy.

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