New-Tech Magazine | JUNE 2025 | Digital Edition

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Motion Automotive and integrity become increasingly important in high-speed Data Center, HPC and AI applications where Si Fly LP is commonly deployed. Each design is unique, so Samtec works with system architects early in the process to create solutions for cable management and thermal load distribution. Samtec’s Si-Fly LP cable systems )CPC, CPI( are in stock directly from Samtec. For more information on Si Fly LP, visit samtec.com/SiFly-LP or contact HDR@samtec.com. www.samtec.com Samtec Israel Tel: 03-7526600 Email: israel@samtec.com Motion Automotive IoT Computers Components Electro Optic & Camera Packaging & Production New Products Motion Automotive Motion Computers Computers Communication IoT Miniature cylindrical Conesys MIL-DTL-26482 connectors now available through Powell Electronics Immediately available through Powell Electronics, the supplier of connectors and more for high-rel applications including defence, aerospace and industrial, are rugged miniature cylindrical Conesys MIL-DTL-26482 connectors )Series II( for commercial, aerospace and military applications. The components feature a reliable bayonet coupling design with rear removable crimp contacts. The Conesys MIL-DTL-26482 connectors are available with aluminium and stainless steel shells, and there are four receptacle mounting styles offered: narrow flange wall mounting receptacles, wide flange wall mounting receptacles, cable connecting receptacles and

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jam nut mounting receptacles which incorporate “O” ring seals, designed for rear panel “D” hole mounting. Plugs are available in two designs, with and without RFI grounding. Thirty-three insert arrangements per MIL-STD-1669 are tooled and qualified to MIL-DTL-26482 Series 2, utilizing 3 to 61 M39029 contacts. Contacts come in sizes 20, 16 and 12, terminating wire sizes from 24 to 12 gauge. Gary Evans CEO, Powell Electronics Europe +353871055441 gevans@powell.com www.powell-electronics.eu www.powell.com

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Samtec Si-Fly® LP, Low-Profile Cable Assemblies Capable of Residing Under IC Cooling Hardware Samtec’s Si-Fly LP cable assemblies target Data Center, HPC and AI applications where z-axis height is limited near the IC package. Samtec, Inc., the service leader in the connector industry, announces production quantity availability of Si Fly LP low-profile cable assemblies. The extremely low 4.35 mm mated height of Si-Fly LP cable-to-board assemblies allow side-to-side, front-to-back or belly-to-belly PCB mounting near the IC package, with secure placement under heat sinks or other cooling hardware where z-axis height is limited. Each Si-Fly LP cable assembly provides 112 Gbps PAM4 channel rate in a 2-row, 16-pair design with aggregate data rates of 896 Gbps )x8 bi-directional( or 1.79 Tbps )x16 uni-directional( and is PCIe 6.0/CXL 3.2 capable. Routing signals from the chip through high-density, high performance Flyover cable reduces thermal challenges, simplifies board layout and improves overall cost by eliminating expensive re-timers and allowing for fewer board layers and less expensive printed circuit board materials. Si-Fly LP cable assemblies feature Samtec’s proprietary 34 AWG, 92 Ohm ultra-low-skew Eye Speed twinax cable. Eye Speed twinax enables superior signal integrity performance using advanced co extrusion techniques that optimize symmetry between signal conductors and shielding, achieving extremely low intrapair skew. Signal reach

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Compact 8:1 fixed ratio digital IBC boosts power efficiency in AI data centers Flex Power Modules announces the launch of the BMR323 — a new generation of non-isolated, unregulated Intermediate Bus Converters )IBCs( designed to meet the growing low-voltage, high-power demands of AI and cloud computing applications. Delivering up to 1.2 kW peak power with a peak efficiency of 97.8%, the BMR323 achieves over 60% more power than its predecessor, the BMR320, while maintaining footprint compatibility. This allows existing designs to be easily upgraded, providing a way to meet rising continuous and peak power requirements with minimal redesign.

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