New-Tech Magazine | MAR 2025 | Digital Edition

THE ULTIMATE ULTRA-MICRO HIGH-POWER INTERCONNECT SOLUTION

15.30 mm

18 A m p s MAX

7.60 mm

Supporting up to 18 Amps per blade in an extremely small, 2.00 mm pitch form factor, Samtec's mPOWER® offers incredible design flexibility and space savings — without compromising power output. The surface mount connector system is available in variety of stack heights, allowing for easy implementation into both new and existing architectures. Discrete wire assemblies support cable-to-board and cable-to cable applications, simplifying board layouts while delivering power directly to active components in the system.

2.00 mm Pitch

Ultra micro surface mount design provides ~40% space savings compared to traditional power interconnects. 4 Position UMPT Series Shown.

samtec.com/mpower

Samtec Israel • 21 Bar-Kochva St. • Concord Tower • B’nei Brak, Israel 51260 Tel: +972 3 7526600 • Fax: +972 3 7526690 • e-mail: israel@samtec.com