New-Tech Magazine | Sep 2023 | Digital Edition

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Motion Automotive multiple PCIe cards or add custom extension boards, all while maintaining an unrivaled small footprint. The option of using NovaRay arrays or cable assemblies fully leverages the flexibility of the prodesign FALCON platform. לקבלת מפרטי המוצרים, עיין ב: www.samtec.com Samtec Israel Tel: 03-7526600 Email: israel@samtec.com Computers Communication

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IPC-A-610 and IPC J-STD-001 Class 3 acceptance criteria is increasing as these types of interconnects are necessary to advance the state of the art for space-constrained applications in areas such as medical and military/ aerospace design. The work in this paper shows that next-generation grid array interconnects meet the solder joint reliability and signal integrity performance required to support these high-reliability high-speed applications. The white paper steps through detailed analysis of the new SMAA connectors, including improved automated x-ray inspection )AXI( as well as reliability testing per IPC-9701 and EIA-364 1000 test methods. The analysis includes both pin-in-ball and non solder ball versions. The tail of the next-generation pin-in-ball grid array component incorporates a fully plated, rounded, and coined bottom with contoured sides for increased robustness and an attached collapsible solder ball. These components are typically soldered to round land patterns. Samtec also offers non-solder ball versions, which use the same tail style but are soldered with increased solder paste volume in lieu of an attached solder ball. The contoured tail style allows deeper tail penetration and an increased solderable surface area with signal integrity performance that supports data rates up to 112 Gbps PAM4 )56 Gbps NRZ( with robust and reliable solder joints that meet industry standards. You can freely access the white paper in the Samtec Technical library to see the specific test methods and simulations used as well as the inspection criteria. The key takeaway is: Next-generation grid array interconnects can be used for advanced and future applications. Samtec currently offers AcceleRate®

Acceleration Card is based on Intel’s high-end Stratix 10 MX/NX technology and is the ultimate multifunctional accelerator for HPC, data center, virtual networks, and broadcast solutions. Stratix 10 has massive memory bandwidth )up to 512Gbit/s( by the integration of 3D-stacked High Bandwidth Memory 2 )HBM2(. Over 2.000.000 Logic Elements )LEs(, over 3900 Digital Signal Processing )DSP( blocks, and a transceiver speed of up to 57.8 GBit/s )PAM4( allow the user to realize their design with maximum flexibility at maximum speed. In addition, the PCIe card is equipped with an Intel MAX10, which is used as Board Management Controller )BMC(. Besides Stratix 10 technology, the prodesign FALCON supports PCIe® 3.0 x16 and offers incredibly high I/O bandwidth featuring four 100GE QSFP-DD front ports enabling 8x 100Gbit/s or 4x 200Gbit/s. Samtec NovaRay Extreme Density Arrays Additional connectivity is provided via three programmable SO-DIMM sockets for DDR4 memory modules or custom extension boards. Three Samtec NovaRay 112 Gbps PAM4 Extreme Density Arrays also offer additional expansion capabilities. The innovative design of NovaRay combines extreme density and extreme performance, which is critical as system sizes decrease and speeds increase. The fully shielded differential pair design and two reliable points of contact contribute to the industry leading 4.0 Tbps aggregate data rate. The NovaRay connectors perfectly complement the prodesign FALCON card’s connectivity. Eight transceiver lanes, ten additional I/Os, and two differential clock pairs per NovaRay provide the possibility to interconnect

Validating the Performance of Miniature Array Connectors Small, complex, and portable applications )in industries such as military/aerospace and medical( require miniaturized, reliable interconnects. As traditional surface mount and through-hole interconnects reach their limits in terms of density and the number of signals that can effectively be used, many product designers are implementing high I/O array styles of interconnects. In a new white paper from Samtec, “Improved Solder Joint Integrity for High Density Interconnect Applications,” the authors, Robbie Huffman and David Decker, detail the design characteristics and verification testing used to validate the robustness of the solder joints as well as the signal integrity in these next-generation board-to-board )B2B( surface mount area arrays )SMAAs(. While pin-in-ball SMAAs have been widely used in the industry for decades, they have lacked IPC classification. The demand for B2B SMAAs compatible with

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