New-Tech Magazine - Europe | January Digital edition

new products

the standard variants with 3.8mm contacts offer an optimized impedance behavior the male connectors with 5.3mm contact lengths provide a 1.5mm higher wipe length of 2.9mm.

showsanongoing trend to increasing data rates and higher bandwidths. Theas means there is a strong need for 100 Gigabit Ethernet (GbE) data transmission. Typical applications are the next generation of internet backbones, data centers or cloud computing. The new ERmet ZDpro connectors fulfill the requirements and challenges of the important interface between backplane and daughter cards in these high speed systems. The ERmet ZDpro is based on the mechanical design of the proven ERmet ZD and ERmet ZDplus with the same dimensions. ERmet ZDpro connectors are backwards mating compatible to ERmet ZD and ZDplus connectors. This means, that existing backplane designs do not need layout changes on the backplane side, if customers want to upgrade their daughter cards in the first step before upgrading the whole system. Of course the layout on the daughter cards has to be modified, if ERmet ZDpro receptacles are used. To benefit from the maximum performance of the new ERmet ZDpro the usage of backdrilling is recommended. Decreasing via stub length and the related “stub effect” by backdrilling significantly reduces the reflections and the overall BER (Bit Error Rate) of the connection. Availability The first products of the ERmet ZDpro family are the 4-pair right angle female connector and the related straight male connector with press-fit termination. Both will be available starting September 2015. The connectors provide 40 signal pairs. The male connectors are available with different contact lengths (3.8mm or 5.3mm). While

can be modularly connected in series, support a broad spectrum of cable cross-sections from AWG30 (0.05 mm²) up to a maximum of AWG12 (3.31 mm²). All products are directly available from stock; free-of-charge samples of the new WR-TBL products can be sent out on request. For further information please visit www.we-online.de

TE Connectivity’s UIC series connectors, now available at TTI, provide robust reliability for railway and mass transit applications Toshiba Corporation’s (TOKYO: 6502) Semiconductor & Storage Products Company today announced the launch of a new generation of highly efficient transistor arrays, the TBD62064A series and TBD62308A series, with a DMOS FET[1] type sink- output[2] driver. The new series succeed the TD62064A series and TD62308A series of bipolar transistor arrays that found wide use in applications including motors, relays and LED drives, and are the industry’s first[3] DMOS FET transistor arrays with a 1.5A sink-output driver. TBD62064APG Mass production of TBD62064A series products is scheduled to start in February 2016. Sample shipments of TBD62308A series products start today, with mass production slated for March 2016. The new products are equipped with 4 channels of 50V/1.5A rated output, suitable for driving constant voltage unipolar stepping motors. Toshiba adopted DMOS FET output

ERNI Electronics Introduces Optimized High- Speed Connectors Introducing the new ERmet ZDpro connector family, ERNI Electronic paves the way to 100G ATCA systems. The ERmet ZDpro connectors are an enhancement of the ERmet ZD family. This high- speed differential Hard Metric connector system enables data rates of >25 Gbit/s and is the first connector system that meets the requirements for 100G ATCA technology. The high data rates and the improved transmission behavior are mainly based on the reduced size of the signal termination, designed for vias with a diameter of only 0.30mm. The drilling hole diameter for the shielding contacts is specified with 0.46mm. The fact that the reduction of the vias leads to an improved crosstalk behavior was the motivation to the further miniaturization of the press-fit zone. The communication technology

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