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are committed to helping customers solve challenges in different scenarios through high-performance solutions and all-around support. This collaboration with Envision Energy supports the promotion of smart distributed wind turbines." לפרטים נוספים: אנלוג מכשורים ישראל 09-7774300 analog.israel@analog.com

iteration. Higher tower barrels, longer blades, and heavier engine rooms bring great challenges for the safe and reliable operation of wind power systems. Among the challenges, the tower barrel is one of the key windmill components requiring monitoring to ensure the safety and reliability of wind power turbines. The tower barrel extends from the ground up to the windmill generator and blades. To promote safety, as well as to help prevent tower collapse and other extreme accidents, Envision Energy joins forces with ADI to introduce predictive maintenance technology into the core control of smart wind turbines. This is done by deploying ADI’s precision inertial measurement unit )IMU( and low noise, low-drift accelerometers on different positions of the tower barrel to monitor the key states of tower barrel in real-time. Information gathered by monitoring tower barrel conditions is used to inform danger prevention measures. "In the long-term, wind power and energy storage will become the energy of the future for the world. While we move toward that goal, safety remains the first factor in the process of value mining," said Haipeng Chen, Director of Intelligent Control Division at Envision Energy. “We are pleased to work with ADI to add its predictive, precision, high reliability MEMS sensors to our wind turbines. This increases the safety of the tower barrel as well as brings the blade diameter and tower barrel height to the next level, continuing to lead the progress of the industry." "ADI has decades of experience in the field of MEMS sensors," said Neil Zhao, Director of MEMS Technology Group Asia at ADI. “We

which includes upgrade options for more data throughput thanks to PCIe Gen4 support. The new COM-HPC and COM Express Computer-on-Modules provide up to 8% single thread and up to 5% multithread[1] performance gains from the soldered 13th Gen Intel Core processors compared to 12th Gen Intel Core processors. The performance gains go hand in hand with a distinctly higher power efficiency due to an enhanced manufacturing process. Also new in this performance class )15-45 W Base Power) are DDR5 memory support and PCIe Gen5 connectivity on selected SKUs. Both contribute to even better multithread performance and data throughput. With up to 80 EU and ultra-fast encode and decode capabilities, the integrated Intel Iris Xe graphics architecture is ideally suited for enhanced graphics demands such as those found in video streaming and video data based situational awareness applications. All these features effect significant improvements in a wide range of industrial, medical, artificial intelligence )AI( and machine learning )ML( applications, as well as all types of embedded and edge computing with workload consolidation. “The numerous improvements of the 13th Gen Intel Core processors help to make these new generations of Computer-on-Modules really outstanding. They give industry the opportunity to instantly upgrade already existing high-end embedded and edge computing solutions, which is what makes this new launch so extraordinarily significant for all our OEM customers and Value Adding Reseller partners,” explains Jürgen Jungbauer, Senior Product Line Manager at congatec.

Happy new year for high end embedded computers: The world’s fastest Client Computer on-Modules generation is here congatec – a leading vendor of embedded and edge computing technology – announces the availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly. congatec expects series production of OEM designs based on these new modules to ramp up quickly and massively as the new processors with long life availability offer vast improvements in many features yet are fully hardware compatible to the predecessors, which makes implementation very fast and easy. With Thunderbolt and enhanced PCIe support up to Gen5, the modules based on the new COM-HPC standard open up new horizons for developers in terms of data throughput, I/O bandwidth and performance density. The COM Express 3.1 compliant modules primarily help to secure investments in existing OEM designs,

New-Tech Magazine l 66