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Motion Automotive for performance, reliability, and scalability. Experience the future of wireless connectivity with Ray3 and unlock the full potential of your network infrastructure. לפרטים נוספים: תל-עד אלקטרוניקה 054-5644820 | 09-7644315 elip@tel-ad.co.il https://tel-ad-systems.com Computers Communication

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logic elements to achieve a QML Class V qualification, and this next-generation solution with lead-free flip-chip bumps is the first of its kind to achieve QML Class V status. In advanced flip-chip package construction, such as that used in the RTG4 FPGA, flip-chip bumps are utilized to connect the silicon die and the package substrate. Lead free bump material will help extend the longevity of the product, which is critical to space missions. “This is another milestone for our RTG4 FPGAs that will provide customers with added confidence in designing these devices in space flight systems, while allowing them to take advantage of our high-reliability, zero-configuration upset and low-power consumption FPGAs,” said Bruce Weyer, corporate vice president for Microchip’s FPGA business unit. “For more than 60 years, Microchip solutions have powered space flight missions, and we are dedicated to product longevity and providing the highest quality solutions.” RTG4 FPGAs are designed to bring high levels of density and performance to space applications, saving cost and engineering efforts through low power consumption and immunity to configuration upsets. Unlike SRAM-based FPGA alternatives, the programming technology used in RTG4 FPGAs provides low static power, which assists in managing thermal issues common in spacecraft. RTG4 FPGAs consume only a fraction of the total power compared to equivalent SRAM FPGAs, while exhibiting zero configuration upsets in radiation and thus requiring no mitigation, reducing engineering expenses and total system costs. To achieve QML Class V qualification, the RTG4 FPGA with lead-free bump has undergone extensive reliability testing, enduring up to 2,000 thermal

Racom Ray3 Point To Point microwave communication units work as a wireless Ethernet point-to-point link in a full duplex setting with transfer speeds of up to 10 Gb/s. The link is formed by two RAy units, each equipped by its own parabolic antenna and accessories to be fully operational. RACOM Ray3 Microwave Links redefine high-speed point-to-point connectivity with their exceptional performance and robust design. Engineered to excel in the most challenging conditions, Ray3 stands as the ultimate solution for Internet Service Providers )ISPs( and global Telco operators alike. Whether deployed for backbone infrastructure or bridging last-mile connections, Ray3 delivers unmatched reliability and speed, ensuring seamless data transmission in any environment. Technically, Ray3 incorporates state-of-the-art microwave technology, offering high throughput rates and low latency, even over long distances. Its advanced modulation schemes and error correction mechanisms guarantee optimal performance, making it ideal for critical applications where reliability is paramount. Additionally, Ray3 boasts adaptive modulation and power control features, allowing it to dynamically adjust to changing environmental conditions and optimize signal strength for maximum efficiency. With support for various frequency bands and flexible channel bandwidths, Ray3 provides versatility to suit diverse deployment scenarios. From urban deployments to remote installations, RACOM Ray3 Microwave Links provide the backbone for modern telecommunications networks, setting new standards

Microchip’s RTG4™ FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification QML Class V designation recognizes exceptional reliability and longevity for critical space missions Satisfying mission assurance requirements for the most critical space programs, Microchip Technology’s )Nasdaq: MCHP( Radiation-Tolerant )RT( RTG4™ Field- Programmable Gate Arrays )FPGAs( with lead-free flip-chip bumps have earned the Qualified Manufacturers List )QML( Class V status. As designated by the Defense Logistics Agency )DLA(, QML Class V is the highest level of qualification for space components and a necessary step to satisfy mission assurance requirements on the most critical space missions such as human rated, deep space and national security programs. Because QML qualifications are standardized based on specific performance and quality requirements governed by the DLA, customers can streamline their design and certification processes by using QML-qualified products. In 2018, RTG4 FPGAs became the first RT FPGAs offering more than 150,000

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