April 2016 issue

Test & Measurement

Packaging & Production

Power Supply

Electro Optics & Camera

Communication

Components

Motion

representatives.

(<5000 KGD, -DP+ model number suffix) and full wafers (-DF+ model number suffix) are also available by request from authorized Mini-Circuits sales representatives. "MCDI" : לפרטים נוספים 077-540-6075 : ט 153-77-540-6051 : פ

suffix) and full wafers (-DF+ model number suffix) are also available by request from authorized Mini-Circuits sales representatives. "MCDI" : לפרטים נוספים 077-540-6075 : ט 153-77-540-6051 : פ

"MCDI" : לפרטים נוספים 077-540-6075 : ט 153-77-540-6051 : פ office@mcdi-ltd.com www.minicircuits.com

office@mcdi-ltd.com www.minicircuits.com

office@mcdi-ltd.com www.minicircuits.com

Mini-Circuits’ MMIC Splitter/Combiner Die Provides 2 to 26.5GHz Coverage in a Single Tiny Device Mini-Circuits’ new EP2K-D+ MMIC 2-way 0˚ splitter/combiner die offers industry-leading bandwidth, covering applications from 2 to 26.5 GHz in a single device. This model is ideal for wideband systems like defense and instrumentation which require full coverage in a single device, and it delivers consistent performance across its entire frequency range, allowing users to reduce part numbers on their bill of materials with one model. The splitter/combiner provides 1.5dB typical insertion loss, 18 dB isolation, 0.1dB amplitude unbalance and 1.5-8.5˚ phase unbalance. It handles up to 2.5W RF input power as a splitter and is capable of passing up to 1.2A DC current from input to output. The die measures only 200x2650x1880µm, allowing integration directly into customer modules where small size and light weight are critical requirements. EP2K-D+ MMIC splitter/combiner dice may be ordered from stock in gel-paks (-DG+ model number suffix) of 10, 50 or 100 KGD. Partial wafers (<5000 KGD, -DP+ model number

Mini-Circuits’ Tiny LTCC 90° Hybrid, 800 to 1250MHz Mini-Circuits’ QCN-12A+ is an ultra- small ceramic surface-mount 90° hybrid supporting applications from 800 to 1250 MHz including cellular, GSM and more. This model provides 0.4 dB insertion loss, 17 dB isolation, 2.5° phase unbalance and 0.5dB amplitude unbalance. It is capable of handling RF input power up to 15W and comes housed in a 1206 LTCC package with wraparound terminations for excellent solderability. It’s the perfect building block for buffering circuits from reflective elements, push-pull amplifiers, and other cases where 90° phase offset is needed. "MCDI" : לפרטים נוספים 077-540-6075 : ט 153-77-540-6051 : פ

Mini-Circuits’ MMIC Amplifier Die Provides High IP3 and Flat Gain from 0.01 to 6GHz Mini-Circuits’ GVA-60-D+ is a Wideband MMIC amplifier die fabricated using InGaP HBT technology supporting a wide range of applications from 0.01 to 6 GHz. This model provides high IP3 of +39 dBm, 20dB gain with ±0.3dB gain flatness from 50 to 1000MHz, +20dBm P1dB, and excellent input/ output return loss (14 to 25dB) without the need for external matching components. The amplifier operates on a single +5V supply and measures only 100x770x700µm, allowing integration directly into customer modules where small size and light weight are critical requirements. GVA-60-D+ MMIC amplifier dice may be ordered from stock in gel-paks (-DG+ model number suffix) of 10, 50 or 100 KGD. Partial wafers (<5000 KGD, -DP+ model number suffix) and full wafers (-DF+ model number suffix) are also available by request from authorized Mini-Circuits sales

office@mcdi-ltd.com www.minicircuits.com

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