New Tech Europe | Jan 2017 | Digital Edition

November

2016January 2017

New-Tech Europe January 2017

18 CES 2017 22

Stepper Motors Use Closed-Loop Technology To Step Into Servo Applications

28 AS9100 Transition Drives Technical Excellence 30 Focus on Embedded Designs

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Visit Arrow at booth 340 in hall 4A

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embedded world Hall 3 Booth 359

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507 rev F

Embedded Controllers & Sensors Embedded Processors, Memories and Storage

Think. Create. Produce.

System On Modules IoT and Connectivity Power & Analog PEMCO FPGA and Programmables System On Chip Security

Visit Arrow at booth 340 in hall 4A.

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WirelessMeshNetwork. Wired Reliability.

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Read To Lead

January 2017

‘New-Tech Magazines’ A world leader in publishing high-tech and electronics, producing top quality publications read by tens of thousands professionals from all over the world especially from Europe, innovative electronics, IoT, microwave, homeland security, aerospace, automotive and technological industries. Our specialized target audiences prefer New-Tech Europe because they know that our publications are a reliable source of the latest information in their respective fields. Our multidimensional editorials, news items, interviews and feature articles provide them with a full, well-rounded picture of the markets in which they operate - an essential asset for every technological leader striving to stay ahead, make the right decisions, and generate the next global innovation. Moreover, as an attractive platform for advertisers from around the world, New-Tech Europe has become a hub for bustling international commercial activity. Here, through ads and other promotional materials, Israeli readers obtain crucial information about developers and manufacturers worldwide, finding the tools, instruments, systems and components they need to facilitate their innovative endeavors. Targeting the needs of both the global and european industries and global advertisers , New-Tech Magazines Group constantly expands and upgrades its services. Over the years, the company has been able to formulate a remarkably effective, multi-medium mix of offerings, combining magazine publications with useful online activities, newsletters and special events and exhibitions.

Editor: Tomer Gur-Arie COO & CFO: Liat Gur-Arie Journalist: Amir Bar-Shalom Technical journalist: Arik Weinstein U.S journalist: Sigal Shahar Graphic Design: Marianna Kudinsky Concept design: Maya Cohen mayaco@gmail.com Technical counselor: Arik Weinstein Sales and advertising: sales@new-techmagazine.com Account Manager: Yael Koffer Rokban Account Manager: Rinat Zolty Meroz Account Manager: Irit Shilo Exhibition Department: Yael Koffer Rokban Data system: Liat Tsarfati Administrator & Exhibition Department: Connie eden Internal Sales Administrator: Shirley Mayzlish Editorial coordinator: Chagit Hefetz Editorial coordinator: Shirley Mayzlish Mail: Office: info@new-techmagazine.com Publisher : NEW-TECH MAGAZINE GROUP LTD

About New-Tech Magazines Group www. new- techeurope . com

8 l New-Tech Magazine Europe

Contents

18

10 18 22

LATEST NEWS

CES 2017

Stepper Motors Use Closed-Loop Technology To Step Into

Servo Applications 28

AS9100 Transition Drives Technical Excellence

22

30 34 38 40 44 46

Focus on Embedded Designs

Implementing a class D audio amplifier

Autonomous vehicles break through to the mainstream SPECIAL IoT EDITION

DK low energy IoT trends

Security for IoT Is a Requirement, Not a Choice

The Internet of Experience SPECIAL POWER SOLUTIONS EDITION

28

48 52

Designing efficient industrial systems

The Changing Landscape of Frequency Mixing Components SPECIAL CONNECTORS & CABLES EDITION

62 64 66 82

The Perfect EMC Connector Design Solution?

OUT OF THE BOX

30

New Products

Advertisers index

www. new- techeurope . com

New-Tech Magazine Europe l 9

LatestNews Leading automotive supplier demonstrates Ultrahaptics’ mid air haptics in concept car at CES® 2017

5th January 2017. Ultrahaptics today announced that its touch-free haptic feedback solution is integrated into a new concept car being exhibited by a major tier 1 supplier into the automotive industry at CES 2017. Bosch, the developer of the car, is demonstrating the technology on its booth in the Central Hall of the Las Vegas Convention Center from January 5th – 8th 2017.

the road and check the display visually.

Ultrahaptics’ technology uses ultrasound to generate a haptic response directly onto the user’s bare hands, without the need for them to hold special equipment. Gesture controls can be used to operate infotainment systems, such as in-car audio and connected-car applications, more intuitively. Ultrahaptics is engaged with the Bosch HMI Group across a variety of applications. Steve Cliffe, CEO of Ultrahaptics, said: ‘The growth we have seen this year and the breadth of applications where our technology is being utilised is staggering. The Bosch application at CES demonstrates how touchless gesture- recognition can help car makers gain greater market acceptance for the incorporation of gesture control’. a development platform for sophisticated mobile AR/VR and smartglasses applications. “The premium Snapdragon 835 processor was designed from the ground-up to support new and innovative products and experiences beyond mobile phones, and it’s great to see that the first announced Snapdragon 835 devices will be ODG’s smartglasses,” said Raj Talluri, senior vice president, product management, Qualcomm Technologies, Inc. “Thermal dissipation on a heavy compute but small device is very difficult so higher power efficiency is a must. The Snapdragon 835 processor, with our unique SoC design expertise on a 10nm process node, enables ODG to meet their design goals and develop lighter, smaller and sleeker smartglasses that take advantage of the new processor’s superior performance

Ultrahaptics’ touchless haptic technology enhances gesture control, providing a leading-edge human–machine interface (HMI) to Bosch’s infotainment system. The Ultrahaptics solution offers drivers the reassurance that their hands are in the right area for a gesture to be recognised and an immediate haptic response to an instruction. This makes driving safer as it avoids accidental cancellation of the command or the need for drivers to take their eyes off

Qualcomm and ODG Announce the First Augmented Reality Smartglasses Powered by the New Snapdragon 835 Processor

At CES® 2017 today, Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), and ODG (Osterhout Design Group), a leading developer and manufacturer of mobile headworn computing and augmented reality technologies and products, announced that R-8 and R-9 will be the first announced devices powered by the Qualcomm® Snapdragon™ 835 processor, which uses 10-nanometer (nm) FinFET process technology to enable a new generation of premium consumer devices in small form factors with breakthrough performance and superior power efficiency. R-8 is ODG’s first consumer mobile AR/VR smartglasses, targeted at the consumer early adopter, and R-9 is for a wide variety of wide field-of-view (FOV) experiences from light enterprise, to prosumer media consumption, and as

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LatestNews

The REAL3™image sensor chip from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) plays a key role in the newest innovative Augmented Reality (AR) smartphone by ASUS. The mobile device was launched yesterday at International CES ® 2017 (International Consumer Electronics Show) in Las Vegas. The ASUS Zenfone AR is the world’s thinnest smartphone that offers a 3D Time-of-Flight (ToF) camera for 3-dimensional perception of its surroundings in real-time. AR enriches the perception of the real environment with written text as well as virtual objects that are embedded in correct scale and realistic perspective. For instance, these “As consumers look for more and more out of their mobile devices, we are seeing a shift taking place towards a new era of mobile computing,” said Ralph Osterhout, founder and chief executive officer, ODG. “This is so much bigger than just a device, it’s about a whole new computing medium that will transform how we interact and discover information and engage with people and objects in the world around us. The Snapdragon 835 processor’s superior performance and power efficiency allows us to accelerate along the path we’ve been striving towards for so long – in bringing a self-contained, lightweight and powerful headworn computing device with stunning visual experiences to the consumer. It is an honor and power efficiency.” The latest in a line of proven, high performance mobile processors, the Snapdragon 835 processor’s architecture allows for higher power efficiency, increased performance, longer battery life, and slimmer device size when compared to previous generations of processors, and ideal for manufacturers racing to meet demand for products that can deliver the next- generation of connectivity-rich user experiences. Snapdragon 835 combines Qualcomm® Kryo™ 280 CPU with Qualcomm Technologies’ many additional low power, high-performance processing technologies to support great battery life for user experiences such as AR and VR, listening to high fidelity audio, watching HD video, playing games, and using the camera/ camcorder. Snapdragon 835 is an Ultra HD Premium mobile processor and supports full 4K/60fps, 10-bit HDR10/HEVC video decode, HDR graphics rendering and display directly to wide color gamut 10-bit 4K displays.

virtual objects may be animated animals or domino bricks in gaming applications. Projecting virtual furniture into a real home environment before ordering items at an online store is another application example. Besides consumer applications, AR can also be used in industrial manufacturing for maintenance of complex equipment and construction. Both, the Infineon REAL3 image sensor and the ASUS Zenfone AR smartphone are on display at the Infineon CES booth MP25265 in South Hall 2 of the Las Vegas Convention Center. Time-of-Flight provides accurate and robust depth data The REAL3 image sensor chip is the key component of the to work so closely with the brilliant minds at Qualcomm Technologies and to be the first to announce that we are integrating this latest technology into devices.” R-8 brings the power of mobile virtual computing to consumers. With a greater than 40˚ FOV and HD resolution, innovative consumers can access the familiarity of movies, sports, gaming, navigation and education experiences but on smartglasses that are lighter, smaller and sleeker than any other device in ODG’s portfolio. R-8 offers the same private screen that floats in your view, wherever you are and however you are moving, with the added dimension of AR, VR and Mixed Reality overlays for a richer computing experience. R-9 is based on ODG’s award-winning 50° FOV and 1080p Project Horizon platform, and is a winner in three CES Innovation Award categories. Targeted to a variety of WFOV experiences from light enterprise to prosumer mobile media consumption, it is also a development platform for sophisticated mobile AR/VR and smartglasses applications. Both devices benefit from advanced features within Qualcomm Technologies’ Snapdragon VR SDK, such as hardware accelerated, visual inertial odometry based 6DOF motion tracking. For more details, see ODG’s release here: http:// osterhoutgroup.com/presskit/pressreleases/Industry_Leader_ ODG_Introduces_R-8_and_R-9_Smartglasses.pdf The Snapdragon 835 is in production now and is expected to ship in commercial devices in the first half of 2017. For more information please visit: https://www.qualcomm.com/ products/snapdragon/processors/835.

ASUS relies on Infineon REAL3™ image sensor chip to bring Augmented Reality into compact smartphones

New-Tech Magazine Europe l 11

LatestNews

world’s smallest 3D camera module for smartphones. It

have spatial awareness of their surroundings and the capability for augmented reality applications with an impressive realistic quality. They pave the way for numerous applications and innovations that were not previously possible.” Coming strong: Augmented Reality in smartphones Today, AR is in an early introduction phase representing a niche market. It will be up to smartphone users to identify applications that they desire

is based on the Time-of-Flight (ToF) principle and measures the time the infrared signal takes to travel from the camera to the object and back again. The elapsed time is called “time of flight”. Compared to other 3D sensing principles, ToF offers advantages in performance, size and power consumption of battery- operated mobile devices. ASUS is among the world’s largest

Dassault Systèmes (Euronext Paris: #13065,DSY.PA),the3DEXPERIENCE Company, world leader in 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions today announced that 3DEXPERIENCE platform users can now view, explore and validate product designs in immersive virtual reality at any stage of the product development process with support from the HTC Vive™ Business Edition virtual reality system. This opens new ways to create and refine engaging customer experiences faster. smartphone manufacturers. Its newest smartphone is less than 9 mm in height. It demonstrates that the REAL3 camera module which has a total height of only 5.9 mm is fully compatible with even the smallest smartphone form factors. Another winning characteristic of the 3D camera module is its low power consumption: it requires less than 150 mW during operation which can be easily delivered by the Zenfone AR’s state-of-the-art 3,300 mAh battery. The ASUS Zenfone AR smartphone is expected to hit the stores later this year. “3D scanning with semiconductors from Infineon helps to interconnect the real and virtual worlds,” said Martin Gotschlich, Director, 3D Imaging at Infineon Technologies. “Mobile devices with an integrated 3D image sensor

3DEXPERIENCE including designers, mechanical engineers, marketers, project managers, manufacturing planners and other decision makers in any industry, can plug and play an HTC Vive Business Edition head-mounted display and work at their desktop with natural navigation in a stereoscopic virtual reality environment. This new way to access, view and explore a native virtual model on the 3DEXPERIENCE platform during product development delivers an enhanced spatial impression for a deeper understanding of an industrial in the course of their daily life. This may realize a huge business potential: just the premium segment of smartphones is rated to be more than 400 million devices sold each year. Currently, already four of the top five camera module makers for mobile devices and smartphones are actively working on camera module designs using Infineon’s REAL3 image sensor. Two of them are already delivering devices in volume quantities. These module designs are inspired by the leading ToF camera reference designs by the company pmdtechnologies. More information about the 3D image sensor family of Infineon and about the company’s demonstrations at CES 2017 is available at www.infineon.com/real3 and at www. infineon.com/CES platform users

Dassault Systèmes Boosts Experience-Thinking Innovation on the 3DEXPERIENCE Platform with the HTC Vive Business Edition

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LatestNews

object’s depth, solidness and design that cannot be achieved with a computer screen alone. “Virtual reality has transcended consumer applications and is now establishing its strategic value for more informed decision- making in business,” said Olivier Ribet, Vice President High-tech Industry, Dassault Systèmes. “Virtual reality paired with our industry solution experiences on the 3DEXPERIENCE platform provides a new and intuitive way to push the boundaries of creativity. Designers and engineers can facilitate the convergence of product aesthetics and technical requirements while a marketer can better influence the user experience for more personal and emotional impact.” “The Vive Business Edition allows Dassault Systèmes’ customers

to use virtual reality at a large scale at low cost,” said Hervé Fontaine, Vice President Virtual Reality Enterprise and Business Development, HTC. “With the Vive’s unique laser tracking system providing sub-millimeter precision and very low latency, it is an ideal fit for Dassault Systèmes’ CATIA applications users who can now check their work in real time as they modify their design.” Virtual reality on the 3DEXPERIENCE platform supported by the HTC Vive Business Edition furthers the collaboration between Dassault Systèmes and HTC to drive virtual reality into the enterprise space. In April 2016, the two companies announced plans to showcase the HTC Vive and 3DEXPERIENCE applications for business and government at select global events.

Qualcomm Brings Active Noise Cancelling Technology into Ultra-Small Earbuds and Headphones

Qualcomm Incorporated (NASDAQ: QCOM) announced that its subsidiary, Qualcomm Technologies, International, Ltd., has introduced active noise cancelling (ANC) technology onto its CSR8675 product platform, making it the world’s first Bluetooth audio system-on- chip (SoC) to integrate such an advanced audio solution. The new feature reduces the complexity and cost of adding active noise cancelling to headphones by eliminating the need for a separate ANC chip, helping manufacturers quickly deliver premium audio experiences in much smaller form factor designs.

experience in any environment, without sacrificing quality when they listen to their music, videos and games,” said Anthony Murray, senior vice president and general manager, IoT, Qualcomm Technologies International, Ltd. “Being the first to bring a Bluetooth audio SoC with integrated active noise cancelling technology allows us to work with manufacturers to integrate noise cancelling technology into a wider range of their products now, while consumers, who have experienced noise cancelling in

high end headsets, are increasingly wanting this capability in their more casual audio headsets which typically retail at lower price points.” “We’ve added the CSR8675 with integrated ANC to our Active Noise Cancelling Bluetooth headphones to offer a high quality audio experience,” said Tom Li, executive vice president of business development, Fujikon Industrial Co., Ltd. “Because the ANC technology is integrated onto the CSR8675 device we can deliver real value to our customers both in terms of cost and performance for end users. The headphones feature an extended playtime of approximately 12 hours and noise cancelling performance of up to -23dB.”

By integrating ANC with CSR8675, which is ideal for ultra- small form factor designs, Qualcomm is taking the category of small form factor in-ear designs to a whole new level and bringing a higher-quality listening experience to consumers who prefer earbuds. The CSR8675 is a fully integrated Flash platform with embedded 120Mhz 24-bit DSP and also supports Qualcomm® aptX™ and Qualcomm® aptX™ HD audio technologies for consistent, high-quality audio streaming over Bluetooth. “Demand for stereo wireless in-ear devices and headsets is growing rapidly. Users want to enjoy a superb audio

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LatestNews

ON Semiconductor License CEVA Imaging and Vision Platform for Automotive ADAS

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that ON Semiconductor has licensed CEVA’s imaging and vision platform for its automotive advanced driver assistance (ADAS) product lines. ON Semiconductor will leverage CEVA’s industry-leading vision processing IP to enhance their future products with new image processing capabilities and to incorporate embedded intelligence and machine learning into its ADAS roadmap.

burgeoning market opportunity. CEVA’s imaging and vision platforms efficiently addresses the intensive processing requirements of the most sophisticated computer vision and deep learning applications such as video analytics, augmented reality and advanced driver assistance systems (ADAS). These highly-efficient vision DSPs and accelerators dramatically reduce the power consumption of the overall system, while providing

automotive and in-car infotainment semiconductor solutions, announced the SAF4000 – the world’s first fully integrated software defined radio solution capable of covering all global broadcast audio standards, including AM/FM, DAB+, DRM(+) and HD. The new IC represents a breakthrough in simplifying the development of high-performance infotainment platforms as it replaces today’s multi-chip solutions with a single ultra-compact RFCMOS device. The SAF4000 is software-defined, thus simplifying the complete flexibility. CEVA’s XM DSPs include a hybrid architecture composed of scalar and vector DSP processors coupled with a comprehensive Application Development Kit (ADK) to streamline software deployment. The CEVA ADK includes: CEVA-Link for seamless software level integration with the host processor; a range of widely used and optimized software algorithms; the CEVA Deep Neural Network (CDNN2) real-time neural network software framework which streamlines machine learning deployment at a fraction of the power consumption of the leading GPU-based systems, and; state-of-the-art development and debugging tools. For developers of Advanced Driver Assistance Systems (ADAS), an ISO 26262 compliant safety design package is available for the CEVA vision processors that enables customers to achieve their desired level of safety certification. For more information, visit http://www.ceva-dsp.com/CEVA-XM-Family.

Software-defined, multi-standard device for global digital and analog broadcast standards AM/FM, DAB(+), DRM(+) and HD Ultra-compact single chip integrating six ICs into one: radio and audio as one combined high-performance system solution Seamless integration with NXP’s latest automotive multimedia processor families and next-generation NXP smart Class D Amplifier LAS VEGAS, Jan. 04, 2017 (GLOBE NEWSWIRE) — At CES® 2017, NXP Semiconductors N.V. (NASDAQ:NXPI), the global leader in The role of intelligent vision processors in automotive safety systems continues to evolve at a rapid pace, with market research firm Strategy Analytics predicting that the emergence of new camera applications and imaging concepts will help drive automotive camera demand to reach almost 200 million units in 2023. With advanced safety features set to be adopted across all price points of the automotive market, there is a strong demand for more cost-effective, flexible and scalable vision architectures. Efficient vision processing addresses computationally-intensive imaging and machine learning use cases, including better low light processing and the ability to run more powerful deep neural networks that can provide the accuracy and performance of tomorrow’s active safety systems. These dynamics have led ON Semiconductor to select CEVA’s imaging and vision platform to augment their ADAS product offerings and address this

NXP Presents the World’s First One-Chip Solution for All Global In-Car Infotainment and Broadcast Standards

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LatestNews

logistics for car OEMs: a single hardware device covers all

high-performance, easy-to-use car infotainment platform with integrated audio in the market. Car infotainment is a true differentiator for carmakers and the competitive automotive marketplace. The integration provided by the SAF4000 reduces complexity and system costs while delivering a 60% power and space savings for great design flexibility.

regional broadcast requirements via an end-of-line firmware update, saving cost and complexity for multiple hardware and software offerings across the globe. In combination with NXP’s newly announced i.MX 8 applications processor and the new TDF8534 smart Class D amplifier, NXP is now able to offer a complete

Piloted driving with artificial intelligence: Audi partnering with top companies in the electronics industry weather and light conditions. It masters its tasks day and night, and even in direct sunlight or harsh artificial light.

Artificial intelligence (AI) is a key technology for piloted driving – that’s why Audi and strong partners from the electronics industry are jointly developing game-changing know-how in the field of machine learning. At the Consumer Electronics Show (CES) in Las Vegas Audi is presenting the Audi Q7 deep learning concept, a piloted driving car made possible thanks to collaboration with NVIDIA. In conjunction with the CES keynote address by NVIDIA, Audi is demonstrating the intelligence of the Q7 deep learning concept on a specially designed, variable open area for piloted driving. The car orients itself by means of a front camera with 2 megapixel resolution, and the camera communicates with an NVIDIA Drive PX 2 processing unit, which in turn controls the steering with high precision. The high-performance controller is specially engineered for piloted driving applications. Serving as the core of the software are deep neural networks that experts from Audi and NVIDIA have trained specifically for autonomous driving and recognition of dynamic traffic control signals. Beginning with a human driver at the wheel, the Audi Q7 deep learning concept gained a limited familiarity with the route and the surroundings, by means of observation and with the help of additional training cameras. That established a correlation between the driver’s reactions and the occurrences detected by the cameras. So during the subsequent demonstration drives the car is able to understand instructions, like from a temporary traffic signal, interpret them right away and act as the situation requires. When a corresponding signal appears, the concept car immediately changes the driving strategy and selects either the short route or the long one. The design of the system is so robust that it can even cope with disturbance variables such as changing

The learning methods used for the Audi Q7 deep learning concept are essentially very much like those of deep reinforcement learning. This method was the underlying principle behind the Audi presence at the Conference and Workshop on Neural Information Processing Systems (NIPS), an AI event held in Barcelona in December. There, the neural networks – which are similar to the human brain – were also trained for a particular application. While the 1:8 scale model car at NIPS learned how to park through trial and error, during the training runs the network of the Audi Q7 deep learning concept receives concrete data it finds relevant – in other words, it learns from the driver. Artificial intelligence is a game-changing key technology for piloted driving – of this Audi is convinced, which is why it is working closely with the leaders in the electronics industry. Together with its partners, Audi is evaluating various approaches and methods for machine learning. The aim is to always find the optimal method for the specific application being studied. Collaborative efforts by companies in the IT and automotive industries are also of tremendous value for future implementation in concepts and production cars. With its impressive systems expertise, NVIDIA is considered the worldwide semiconductor industry’s biggest, most capable player. Audi has been working with the manufacturer since 2005. The Audi A4 was using an NVIDIA chip as early as 2007, and two years later NVIDIA technology allowed the Audi A8 to achieve a new dimension in visual displays. The Modular Infotainment Platform (MIB), which was introduced in 2013, featured the Tegra 2 processor from NVIDIA. And the MIB2 followed in the

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LatestNews

Audi Q7 in 2015, running with an NVIDIA T 30 processor. The platform’s next level of development is the MIB2+ – which is premiering this year in the new generation of the Audi A8. Its key element is the Tegra K1 processor, which makes new functions possible and has the impressive computing power needed to support several high-resolution displays – including the second-generation Audi virtual cockpit. Onboard and online

Q5 – and the product’s image processing software can recognize a large number of objects. These include lane markings, vehicles, traffic signs and pedestrians. Today, defining the characteristics needed to clearly classify objects is still done manually. In the new Audi A8, Audi and Mobileye are demonstrating the next level of development – with image recognition that uses deep learning methods for the

information will merge, making the car part of the cloud to a greater degree than ever. Together with the MIB2+, the central driver assistance controller (zFAS) in the new Audi A8 is also making its series debut. The K1 processor is also on board and in future the X1 processor from NVIDIA. Audi and NVIDIA are planning to intensify their long-standing partnership by combining NVIDIA’s development environment expertise for AI applications with Audi’s wealth of experience in the area of vehicle automation. Another Audi key partner is Mobileye, whose image processing chip also is integrated in the zFAS. The high-tech Israeli company is the world leader in the field of image recognition for automotive applications. Mobileye is already supplying a camera for use in a range of Audi models – the Audi Q7, the A4/A5 series and the new BMW Group, Intel and Mobileye will have autonomous test vehicles on the roads by the second half of 2017 first time. This significantly reduces the need for manual training methods during the development phase. Deep neural networks enable the system to be self-learning when determining which characteristics are appropriate and relevant for identifying the various objects. With this methodology the car can even recognize empty driving spaces, an important prerequisite for safe, piloted driving. The traffic jam pilot function will be offered in a series production model for the first time in the new A8. This is the first piloted driving function in series production that will enable the driver to let the vehicle take over full control at times. With this step the stage is set to begin the next decade with higher levels of automation in a growing number of driving situations.

MW Group, Intel and Mobileye will have autonomous test vehicles on the roads by the second half of 2017 The BMW Group, Intel, and Mobileye announce a fleet of approximately 40 autonomous test vehicles that will be on the roads by the second half of 2017 The three companies reveal details about their partnering model including a scalable architecture that can be used by other auto developers BMW Group, Intel and Mobileye today announced that a fleet of approximately 40 autonomous BMW vehicles will be on the roads by the second half of 2017, demonstrating the significant advancements made by the three companies towards fully autonomous driving. Revealing this at a podium discussion held during a joint press conference at CES, the companies further explained that the BMW 7 Series will employ cutting-edge Intel and Mobileye technologies during global trials starting in the U.S. and Europe.

This news follows the partnership that was announced between the BMW Group, Intel and Mobileye in July of last year. The companies have since developed a scalable architecture that can be adopted by other automotive developers and carmakers to pursue state of the art designs and create differentiated brands. The offerings scale from individual key integrated modules to a complete end-to-end solution providing a wide range of differentiated consumer experiences. As part of this partnership, the BMW Group will be responsible for driving control and dynamics, evaluation of overall functional safety including setting up a high performance simulation engine, overall component integration, production of prototypes and eventually scaling the platform via deployment partners. Intel brings to the partnership innovative high performance computing elements that span from the vehicle to the data center. The newly launched Intel® GO™ solution for autonomous driving offers world class processor and FPGA technologies

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LatestNews

for the most efficient balance of performance and power, while meeting the stringent thermal and safety requirements of the automotive industry. Within the car, the Intel GO solution offers a scalable development and compute platform for critical functions including sensor fusion, driving policy, environment modeling, path planning and decision making. In the data center, Intel GO offers a wide range of technologies ranging from the high performance Intel® Xeon® processors,

in combination with Intel CPU and FPGA technologies, forms the Central Computing Platform to be integrated into each autonomous vehicle. Mobileye will further collaborate with the BMW Group to develop the sensor fusion solution, creating a full model of the environment surrounding the vehicle, using input from vision, radar, and lidar sensors. As well as establishing a driving policy, including

to Intel ® Arria ® 10 FPGAs and Intel® Solid State Drives to the Intel® Nervana™ platform for artificial intelligence that provides a powerful machine and deep learning training and simulation infrastructure required for the autonomous driving industry. Mobileye contributes its proprietary EyeQ ® 5 high-performance computer vision processor offering automotive-grade functional safety and low-power performance. The EyeQ®5 is responsible for processing and interpretation of input from the 360-degree surround view vision sensors as well as localization. EyeQ®5, Rohde & Schwarz presents new HLG test solution for latest-generation video consumer electronics Mobileye’s reinforcement learning algorithms used to endow the vehicle system with the artificial intelligence required to safely negotiate complex driving situations. To further propel the development of the autonomous platform, the partnership plans to release hardware samples and software updates in the upcoming years. The BMW iNEXT model, which will be introduced in 2021, will be the foundation for BMW Group’s autonomous driving strategy. Following this vehicle, a range of highly automated models from all BMW Group brands will follow.

Rohde & Schwarz is expanding its R&S VTx video tester family to include tests for HLG-capable devices in line with the HDMI 2.0b standard. Hybrid Log-Gamma (HLG) is an enhancement to the high dynamic range (HDR) technique that allows good-quality replay of state-of-the-art picture material even on non-HDR-capable devices. This is a crucial factor in the successful introduction of the spectacular HDR technique for a more intensive and realistic home theater experience. The Rohde & Schwarz R&S VTC/VTE/VTS video tester family is an innovative solution for testing the performance and interoperability of future generations of HDR/HLG-capable video consumer electronics. It is based on the recently introduced flexible T&M module for HDMI and HDR tests. The new module offers generator and analyzer functionality for data rates up to 18 Gbit/s as well as functions such as scrambling introduced with the new HDMI standard. Now it can also test HLG-capable devices. This includes testing and emulation of the signaling function and

the generation of new test patterns. The solution is downward compatible with HDMI 1.4 and supports HDCP 1.4 and HDCP 2.2. It covers realtime protocol testing and compliance testing in line with HDMI CTS 1.4/2.0, providing users with a test tool that can be used in various applications throughout the consumer electronics

value chain. The generator function can be used to edit the Dynamic Range and Mastering InfoFrame specifically for HDR and HLG. It displays the Enhanced Extended Display Identification Data (E-EDID) of the connected sink, including the HDR metadata block. It also permits the playback of customer-specific, uncompressed moving picture sequences. The analyzer unit provides suitable E-EDID and displays the Dynamic Range and Mastering InfoFrame. The video analyzer functionality provides bit-accurate display of the electro-optical transfer function (EOTF) in use. HDR CTS tests are available for both the generator and the analyzer.

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groundbreaking announcements based on the company’s leadership in developing advanced graphics processors and artificial intelligence. Mass Effect: Andromeda, a popular video game made by BioWare, was previewed by NVIDIA along with GeForce NOW™, a streaming service that turns any PC into a powerful gaming PC from the cloud. Huang also unveiled a new version of the Shield TV -- now just called Shield -- which will support 4K HDR for both games and movies making it the world’s first 4K HDR entertainment platform. To support Shield’s Artificial Intelligence (AI), Huang introduced NVIDIA SPOT, a plug-in device that understands natural language and complex patterns to help build a user’s AI experience. Huang also announced an AI car supercomputer called Xavier used in NVIDIA’s own self- driving car BB8 and a new capability on the NVIDIA AI car computer called AI Co-Pilot, which provides drivers with road alerts and recognizes facial expressions and voice recognition to improve drivers’ experience. Huang further announced an expanded partnership with Audi to develop artificial intelligence for a new generation of self-driving cars, with plans to have vehicles on the road by 2020. He also provided details on partnerships with mapping companies HERE and ZENRIN; and two of the world’s largest automotive suppliers, ZF and Bosch. Wednesday also kicked off the C Space Storytellers series, with key influencers and newsmakers sharing best practices surrounding the relationships among brands, entertainment and technology. In the series’ first session, Spotify’s Alex Underwood moderated a panel with executives from GroupM, Nestle S.A. and Wordsworth and Booth providing a 30,000 foot view of the advertising opportunities in audio. During the Nielsen Storytellers session, Nielsen’s Executive

The World’s largest innovation event took place during the first week of January with record-breaking CES Unveiled, preshow Media Days and NVIDIA keynote CES® 2017 celebrated the show’s 50th anniversary with a recording-breaking exhibit floor spanning more than 2.6 million net square feet. More than 3,800 companies launched their innovative products at CES, including an unprecedented 600 startups in Eureka Park. Owned and produced by the Consumer Technology Association (CTA)TM, CES 2017 ran Sunday January 1st through Sunday, January 8, in Las Vegas, Nevada. “What an incredible way to celebrate the 50th anniversary of CES – with the largest show floor in our history showcasing the next generation of innovation that will revolutionize our world,” said Gary Shapiro, president and CEO, CTA. “The products and services unveiled at CES 2017 will touch nearly every single global industry. From the latest in virtual reality, smart home, self-driving vehicles, robotics, wearables, health and fitness tech and more, CES 2017 is unveiling the future of the connected experience and what it means for consumers around the world.” CES welcomed NVIDIA founder & CEO Jen-Hsun Huang to the keynote stage Wednesday night, where he made multiple

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CTA President and CEO Gary Shapiro gives his annual keynote address at CES 2017

NVIDIA Keynoter CEO Jen-Hsun Huang at CES 2017

Samsung at CES 2017 Media Day 2

Qualcomm demonstrates new product to media during its CES News Conference

Attendees enjoy a "Whoa" experience with virtual reality at CES 2017

Toyota unveils new concept car at CES 2017 Media Day 2

C Space panel at CES 2017

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Vice President & Global Retail Practice Leader Louise Keely discussed new technologies for advertising for consumer- facing companies. In this “period of great disruption” in the consumer path to purchase, companies must change measurement tools and methods. Preshow media events kicked off on Tuesday which included the largest CES Unveiled in history. The official media event of CES 2017 featured a record 190 exhibiting companies, an 18 percent increase over 2016, including 60 startups from Eureka Park, the most startups ever showcased at CES Unveiled. Featuring the latest in virtual reality, companion sensing robots, wireless headphones, sleep trackers, smart lighting, wearables and more, CES Unveiled provided the more than 2,000 media attending with a sneak peak of the innovation launching this week at the show. New for 2017, CES included two full Media Days where companies large and small introduced products to the global market. Setting the stage for a week filled with innovation, 28 companies hosted preshow news conferences, with a wide array of major product announcements: A&D Medical/Mobile Health – The MobileHelp Tablet Medical Alarm with MobileVitals Monitoring. BMW – Prototype of BMW’s 7-fully automated sedan. Bosch – Concept car featuring face recognition and intelligent personalization, gesture control with Ultra Haptics, a crystal-clear OLED display and digital exterior mirrors. Carnival – Ocean Medallion, a highly personalized wearable concierge service, which enables elevated service through enhanced guest interactions during the entire cruise experience. Casio – PRO TREK, a smart watch, which uses Android Wear 2.0 and is equipped with low-power GPS and new full- color map functionality. Continental – High-Resolution 3D Lash Lidar, capable of 3D measurement of the environment in challenging conditions such as fog, dust, rain and light. Faraday Future – The FF 91, a fully-electric, fully- connected, self-driving, keyless vehicle experience with a “driverless valet” function that allows the car to park itself from your smartphone. FCA – Portal, a concept car, is battery electric, cloud connected and offers fully self-driving capabilities. Hisense – The H10D 4K HDR TV, featuring proprietary ULED display technology, quantum dot wide color gamut and full array local dimming. Huawei/Honor Brands – The Honor 6X dual- camera, dual-sensor smartphone, retailing for $250 USD. Hyundai – IONIC Scooter, a "micro mobility" fold-up scooter aimed at those who live in urban environments with limited parking options. LG – LG Signature OLED TV W, or the “The Wallpaper TV.” The 65” model is 2.57 mm wide – 1/10th of an inch –

with no gap between the TV and wall. Lucaro – iRobotics 7 Medical Massage Chair, a full-body massage chair that also uses blood pressure and heart rate monitoring for added comfort and options. Monster – Soundstage 2, to be integrated with Amazon Alexa. Panasonic – Lumix GH5 mirrorless camera that excels at shooting video and has 4K and 6K capabilities. Qualcomm – Snapdragon 835, the first 10 nanometer mobile processor, with enhanced efficiency that helps to create thinner phones with longer battery life. Royole – The Royole Moon, a 3D virtual mobile theater combining 1080p AMOLED displays at over 3000 ppi resolution that simulate a giant 800” curved screen, with stereoscopic 3D and noise-cancelling headphones for a completely immersive experience. Samsung – The Wash and FlexDry IoT-enabled washer/ dryer system featuring four separate compartments for washing and drying, letting you maximize efficiency and customize how you manage your laundry. Sony – Crystal LED integrated structure display, with superfine LED structures serving as a light source, making it virtually impossible to see the pixels. TCL – The Xess series – X2 and X3 models – which are edgeless, flat and curved proving ultimate picture quality. Toyota – Concept-i, a self-driving car allowing passengers to interact with the car’s artificial intelligence agent named “Yui,” which anticipates drivers’ needs, measures emotions and responds automatically. Valeo – The 360AEB Nearshield, an emergency braking system that eliminates drivers’ blind spots, bringing the vehicle to a stop in emergency situations. VOXX – Terk delivers the strongest Wi-Fi signals throughout the home, as well as free HDTV. The soon-to-be released Terk Omni features circle beam technology, which will allow you to receive broadcast signals up to 65 miles away. ZF – The ZF ProAI, a deep learning software and ZF’s first step into artificial intelligence that goes beyond automotive applications. ZTE – The Hawkeye, the world's first crowdsourced phone. Wednesday afternoon also featured ShowStoppers LaunchIt, the Official Pitch Event at CES, built around the entrepreneurial companies that exhibit in Eureka Park, the home for startups at CES. Twelve startups pitched their products to a standing room-only crowd. First prize was awarded to Nonda, makers of a family of connected, app-enabled devices for the vehicle. Kino-mo, developer of high tech smart holographic displays, took second place. Third place was awarded to In&Motion, creator of a smart wearable that aims to reduce the risk of serious injury due to falls.

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