New-Tech Europe Magazine | May 2018

(bottom). The superior P/N elements of arcTEC structure modules also help to improve cooling time by more than 50%. The enhanced life expectancy of arcTEC structure modules can be demonstrated by analyzing the change in internal resistance of Peltier modules exposed to thermal cycling. Because resistance change within Peltier modules is closely linked to bond failure, analyzing the trend provides a useful indication of lifetime. The results shown in figure 7 further demonstrate the significant improvement in life expectancy made possible by the arcTEC structure. Conclusion Although the physics of thermoelectric cooling have been understood for many generations, the arrival of suitable Peltier modules, ready to be designed- in to commercial electronic products, is a relatively new phenomenon. There are numerous advantages on offer, including faster response, improved temperature stability and greater flexibility to control the temperature of critical devices such as ICs, laser diodes or sensors. Many new and innovative applications for Peltier modules are expected to emerge as designers gain familiarity with the products and design techniques. Care should be taken when selecting Peltier modules and designing control circuitry, to operate the modules well within their thermal limits. Today’s most advanced Peltier modules, designed with flexible internal interconnects and high-purity P/N pellets, have unlocked further improvements in thermal response and reliability. View CUI’s full portfolio of Peltier modules Learn more about thermoelectric cooling with CUI’s Peltier Module PTM Read more about CUI’s arcTEC structure Ends

Figure 6. Improved temperature distribution in arcTEC structure modules (below) compared to conventional modules (above)

Figure 7. Assessing reliability by monitoring resistance change

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