New Tech Europe | Jan 2017 | Digital Edition

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The REAL3™image sensor chip from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) plays a key role in the newest innovative Augmented Reality (AR) smartphone by ASUS. The mobile device was launched yesterday at International CES ® 2017 (International Consumer Electronics Show) in Las Vegas. The ASUS Zenfone AR is the world’s thinnest smartphone that offers a 3D Time-of-Flight (ToF) camera for 3-dimensional perception of its surroundings in real-time. AR enriches the perception of the real environment with written text as well as virtual objects that are embedded in correct scale and realistic perspective. For instance, these “As consumers look for more and more out of their mobile devices, we are seeing a shift taking place towards a new era of mobile computing,” said Ralph Osterhout, founder and chief executive officer, ODG. “This is so much bigger than just a device, it’s about a whole new computing medium that will transform how we interact and discover information and engage with people and objects in the world around us. The Snapdragon 835 processor’s superior performance and power efficiency allows us to accelerate along the path we’ve been striving towards for so long – in bringing a self-contained, lightweight and powerful headworn computing device with stunning visual experiences to the consumer. It is an honor and power efficiency.” The latest in a line of proven, high performance mobile processors, the Snapdragon 835 processor’s architecture allows for higher power efficiency, increased performance, longer battery life, and slimmer device size when compared to previous generations of processors, and ideal for manufacturers racing to meet demand for products that can deliver the next- generation of connectivity-rich user experiences. Snapdragon 835 combines Qualcomm® Kryo™ 280 CPU with Qualcomm Technologies’ many additional low power, high-performance processing technologies to support great battery life for user experiences such as AR and VR, listening to high fidelity audio, watching HD video, playing games, and using the camera/ camcorder. Snapdragon 835 is an Ultra HD Premium mobile processor and supports full 4K/60fps, 10-bit HDR10/HEVC video decode, HDR graphics rendering and display directly to wide color gamut 10-bit 4K displays.

virtual objects may be animated animals or domino bricks in gaming applications. Projecting virtual furniture into a real home environment before ordering items at an online store is another application example. Besides consumer applications, AR can also be used in industrial manufacturing for maintenance of complex equipment and construction. Both, the Infineon REAL3 image sensor and the ASUS Zenfone AR smartphone are on display at the Infineon CES booth MP25265 in South Hall 2 of the Las Vegas Convention Center. Time-of-Flight provides accurate and robust depth data The REAL3 image sensor chip is the key component of the to work so closely with the brilliant minds at Qualcomm Technologies and to be the first to announce that we are integrating this latest technology into devices.” R-8 brings the power of mobile virtual computing to consumers. With a greater than 40˚ FOV and HD resolution, innovative consumers can access the familiarity of movies, sports, gaming, navigation and education experiences but on smartglasses that are lighter, smaller and sleeker than any other device in ODG’s portfolio. R-8 offers the same private screen that floats in your view, wherever you are and however you are moving, with the added dimension of AR, VR and Mixed Reality overlays for a richer computing experience. R-9 is based on ODG’s award-winning 50° FOV and 1080p Project Horizon platform, and is a winner in three CES Innovation Award categories. Targeted to a variety of WFOV experiences from light enterprise to prosumer mobile media consumption, it is also a development platform for sophisticated mobile AR/VR and smartglasses applications. Both devices benefit from advanced features within Qualcomm Technologies’ Snapdragon VR SDK, such as hardware accelerated, visual inertial odometry based 6DOF motion tracking. For more details, see ODG’s release here: http:// osterhoutgroup.com/presskit/pressreleases/Industry_Leader_ ODG_Introduces_R-8_and_R-9_Smartglasses.pdf The Snapdragon 835 is in production now and is expected to ship in commercial devices in the first half of 2017. For more information please visit: https://www.qualcomm.com/ products/snapdragon/processors/835.

ASUS relies on Infineon REAL3™ image sensor chip to bring Augmented Reality into compact smartphones

New-Tech Magazine Europe l 11