New Tech Europe | Jan 2017 | Digital Edition

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world’s smallest 3D camera module for smartphones. It

have spatial awareness of their surroundings and the capability for augmented reality applications with an impressive realistic quality. They pave the way for numerous applications and innovations that were not previously possible.” Coming strong: Augmented Reality in smartphones Today, AR is in an early introduction phase representing a niche market. It will be up to smartphone users to identify applications that they desire

is based on the Time-of-Flight (ToF) principle and measures the time the infrared signal takes to travel from the camera to the object and back again. The elapsed time is called “time of flight”. Compared to other 3D sensing principles, ToF offers advantages in performance, size and power consumption of battery- operated mobile devices. ASUS is among the world’s largest

Dassault Systèmes (Euronext Paris: #13065,DSY.PA),the3DEXPERIENCE Company, world leader in 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions today announced that 3DEXPERIENCE platform users can now view, explore and validate product designs in immersive virtual reality at any stage of the product development process with support from the HTC Vive™ Business Edition virtual reality system. This opens new ways to create and refine engaging customer experiences faster. smartphone manufacturers. Its newest smartphone is less than 9 mm in height. It demonstrates that the REAL3 camera module which has a total height of only 5.9 mm is fully compatible with even the smallest smartphone form factors. Another winning characteristic of the 3D camera module is its low power consumption: it requires less than 150 mW during operation which can be easily delivered by the Zenfone AR’s state-of-the-art 3,300 mAh battery. The ASUS Zenfone AR smartphone is expected to hit the stores later this year. “3D scanning with semiconductors from Infineon helps to interconnect the real and virtual worlds,” said Martin Gotschlich, Director, 3D Imaging at Infineon Technologies. “Mobile devices with an integrated 3D image sensor

3DEXPERIENCE including designers, mechanical engineers, marketers, project managers, manufacturing planners and other decision makers in any industry, can plug and play an HTC Vive Business Edition head-mounted display and work at their desktop with natural navigation in a stereoscopic virtual reality environment. This new way to access, view and explore a native virtual model on the 3DEXPERIENCE platform during product development delivers an enhanced spatial impression for a deeper understanding of an industrial in the course of their daily life. This may realize a huge business potential: just the premium segment of smartphones is rated to be more than 400 million devices sold each year. Currently, already four of the top five camera module makers for mobile devices and smartphones are actively working on camera module designs using Infineon’s REAL3 image sensor. Two of them are already delivering devices in volume quantities. These module designs are inspired by the leading ToF camera reference designs by the company pmdtechnologies. More information about the 3D image sensor family of Infineon and about the company’s demonstrations at CES 2017 is available at www.infineon.com/real3 and at www. infineon.com/CES platform users

Dassault Systèmes Boosts Experience-Thinking Innovation on the 3DEXPERIENCE Platform with the HTC Vive Business Edition

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