New-Tech Europe Magazine | July 2017

July 2017

New-Tech Europe July 2017 22 60GHz technology

opens door to WiGig ® and 5G applications 26 Stack based processing at the Edge and Cloud 30 A Perspective on the Definition of Value in the RF Supply Chain 38 Taking the Risk Out of SW-Driven Networking SoCs solutions for image

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July 2017

‘New-Tech Magazines’ A world leader in publishing high-tech and electronics, producing top quality publications read by tens of thousands professionals from all over the world especially from Europe, innovative electronics, IoT, microwave, homeland security, aerospace, automotive and technological industries. Our specialized target audiences prefer New-Tech Europe because they know that our publications are a reliable source of the latest information in their respective fields. Our multidimensional editorials, news items, interviews and feature articles provide them with a full, well-rounded picture of the markets in which they operate - an essential asset for every technological leader striving to stay ahead, make the right decisions, and generate the next global innovation. Moreover, as an attractive platform for advertisers from around the world, New-Tech Europe has become a hub for bustling international commercial activity. Here, through ads and other promotional materials, Israeli readers obtain crucial information about developers and manufacturers worldwide, finding the tools, instruments, systems and components they need to facilitate their innovative endeavors. Targeting the needs of both the global and european industries and global advertisers , New-Tech Magazines Group constantly expands and upgrades its services. Over the years, the company has been able to formulate a remarkably effective, multi-medium mix of offerings, combining magazine publications with useful online activities, newsletters and special events and exhibitions.

Editor: Tomer Gur-Arie COO & CFO: Liat Gur-Arie Journalist: Amir Bar-Shalom Technical journalist: Arik Weinstein U.S journalist: Sigal Shahar Graphic Design: Hadas vidmayer Concept design: Maya Cohen mayaco@gmail.com Technical counselor: Arik Weinstein Sales and advertising: sales@new-techmagazine.com Account Manager: Yael Koffer Rokban Account Manager: Rinat Zolty Meroz Account Manager: Irit Shilo Account Manager: Tatiana Yamin Exhibition Department: Yael Koffer Rokban Data system: Liat Tsarfati Administrator & Exhibition Department: Lihi Levi Internal Sales Administrator: Shirley Mayzlish Editorial coordinator: Chagit Hefetz Editorial coordinator: Shirley Mayzlish Mail: Office: info@new-techmagazine.com Publisher : NEW-TECH MAGAZINE GROUP LTD

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8 l New-Tech Magazine Europe

Contents

22

10 18

LATEST NEWS

Next-gen MCUs enable better design techniques, add functionality and use less power 60GHz technology opens door to WiGig ® and 5G applications Stack based solutions for image processing at the Edge and Cloud A Perspective on the Definition of Value in the RF Supply Chain 5G - It’s Not Here Yet, but Closer Than You Think Taking the Risk Out of SW-Driven Networking SoCs the fundamentals of secure boot and secure download: how to protect firmware and data within embedded devices Measuring Ultra-Low Power in Wireless Sensor Node Applications Using the Digit Graphical Sampling Multimeter IoT Special Edition

22

26

26

30

34 38 42

48

30

54 56

Hardware-based trust provides key to IoT security

Simplifying Sub-GHz IoT Green Energy Special Edition

62

Ecosystem for Optimizing Energy Efficiency in Factory Production Systems

66 68 82

OUT OF THE BOX

38

New Products

Advertisers index

www. new- t echeurope . com

New-Tech Magazine Europe l 9

LatestNews

UK Power facility upgraded to meet increased demand and enhance regional offering

and test activity to our Reading headquarters to improve economies of scale and efficiencies between our design, manufacture, assembly and distribution business model. Having a ‘one stop shop’ on site at Reading puts us in a better position to deliver best in class service to customers. It also enables us to fully support Stadium Group’s other business units in Connectivity, HMI and Electronics Assembly with regional inventory holding and logistics programs tailored to our customers’ needs.

Stadium Stontronics, a leader in the design and manufacture of power supplies and cable products, has significantly upgraded its Reading- based facility with the addition of a new dedicated manufacturing cell fully equipped for the production of custom power supplies, a new warehouse space to accommodate an additional 700 pallets of storage, plus a large ESD controlled test facility. Extending its premises in Reading to

more than 25,000 square feet, the business today specialises in the manufacture and distribution of AC-DC power supplies, DC-DC converters, desktops, plugtops, custom power solutions, cable products, primarily for the industrial, medical, security, LED lighting and single board computing markets. Stadium Stontronics Managing Director Martin Brabham commented: “The expansion demonstrates our commitment to building a world class power supply business with dedicated design, manufacturing, assembly and distribution capabilities both in the UK and China.” “We have added supplementary power supply manufacturing “The new warehouse space will enable us to further improve upon our existing high order fulfilment rates, and ensure that we have the right products, ready to ship for next day delivery.” Martin added: “Upgrading our facilities has allowed us to re- design the whole process in the warehouse and improve safety. We’ve been able to pedestrianise large areas, reduce the requirement for fork lift truck usage and keep noisy processes such as cable winding & ultrasonic welding separate.” Honeywell Powers First Connected Helicopter Flight Around The World

embark on their trip July 1, 2017, to celebrate the 150th anniversary of Canada’s confederation. The tour will kick off at the Canada Aviation and Space Museum in Ottawa before making more than 100 stops in 14 countries. The Aspire 200 system, with its High-Data Rate software package, brings high-speed, high- bandwidth Wi-Fi capabilities to the helicopter. With Honeywell’s Aspire 200 and GoDirect Cabin Connectivity,

OTTAWA, Ontario, June 29, 2017 / PRNewswire/ — Honeywell’s (NYSE: HON) advanced Connected Aircraft satellite communications products and services are connecting a Bell 429 helicopter during Canada’s first helicopter flight around the world. The Canadian father-son team will use Honeywell’s Aspire 200 Wi-Fi system and GoDirect™ Cabin Connectivity services to share their planned 37-day journey and stay connected from the air everywhere in the world, including over cities, mountains and oceans. The C150 Global Odyssey team of Bob and Steven Dengler will

plus highly reliable data connectivity through Inmarsat’s global L-band satellite constellation throughout the tour, the team will experience Wi-Fi speeds of up to 350 Kbps per channel.

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speed, reliable connectivity on global journeys very challenging. Honeywell’s Aspire 200 and connectivity enable us to share photos and videos of our adventure from the air, but they also provide real-time data to manage mission risk as we fly, greatly enhancing our safety no matter where we travel,” said Bob Dengler, pilot, C150 Global Odyssey. “Our biggest need for this journey is reliable, global service that provides consistent coverage anywhere in the world. Honeywell’s offering does that and more.” In honor of Canada’s 150th birthday, the C150 Global Odyssey team will fly more than 20,000 nautical miles and plans to stop at more than 100 airports across 14 countries. Throughout their journey, the team will be joined by notable Canadians including astronaut Dave Williams, hockey legend Guy Lafleur and photojournalist Peter Bregg. The C150 Global Odyssey is raising awareness for the Southlake Regional Health Centre Foundation and True Patriot Love Foundation.

These speeds will enable real-time uploads to social media, videoconferencing capabilities, and access to updated weather information along their journey. “Honeywell has been a leader in aviation technology for more than 100 years, and has been connecting planes for 25 years. No one has more expertise than Honeywell when it comes to getting critical data on and off an aircraft and making flights safer and more efficient,” said Warren Nechtman, vice president, Connected Aircraft Systems, Honeywell Aerospace. “This is why we’re happy to sponsor the C150 Global Odyssey. Helicopter connectivity can be a challenge due to the rotor blades interrupting the satellite signal to and from the aircraft. Honeywell, in coordination with Inmarsat satellite technology, is overcoming that barrier with its Aspire 200 and GoDirect Cabin Connectivity to make sure that the Denglers’ flight has consistent, high- speed connectivity from start to finish.” “Connectivity on helicopters is often spotty and inconsistent because the rotor blades that power the aircraft disrupt connections to satellites. This makes maintaining high-

ARIANE 5 LAUNCH PROVES RELIABILITY AND FLIES NEW FAIRING An Ariane 5 carrying two telecom satellites inside a new lighter fairing lifted off on the fourth mission from Europe’s Spaceport in two months. Liftoff came at 21:15 GMT (18:15 local time, 23:15 CEST) last night from Kourou, French Guiana on a mission lasting about 39 minutes to deliver Hellas Sat 3–Inmarsat S EAN and GSAT-17 into their planned orbits. Hellas Sat 3–Inmarsat S European The payload mass for this launch was 10 177 kg. The satellites totalled about 9269 kg, with payload adapters and carrying structures making up the rest. Four-panel fairing for Ariane 5 The protective payload fairing proved by this launch was built from only four instead of the usual 14 panels. Fewer metallic junctions reduced the mass by 107 kg, giving a performance gain of about 10 kg

in geostationary transfer orbit. Different composite material and optimised manufacturing processes also lowered costs. From August, Vega will use fairings built in the same way. “Switzerland’s Ruag Space with Airbus Safran Launchers as prime contractor, developed this fairing under ESA’s Launchers Exploitation Accompaniment Programme which nurtures innovation within European industry to guarantee independent access to space for Europe. “This new fairing for Ariane 5 qualifies the

Aviation Network, with a mass of 5792 kg, was the first to be released after about 28 minutes. The 3477 kg GSAT-17 was released 13 minutes later. Hellas Sat 3–Inmarsat S EAN, will provide direct-to-home and telecom services to Europe, the Near East and sub- Saharan African countries, and inflight broadband within Europe. The Indian Space Research Organization’s GSAT- 17 will provide communications services, data relay, and search and rescue services. Both satellites have a design life of more than 15 years.

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manufacturing technology that will be used for Ariane 6, which will comprise only two panels,” commented ESA’s Daniel de Chambure, Ariane 5 Future Mission Manager. Four launches in two months is a peak achievement. In May and June there was one Soyuz, and three Ariane 5 launches.

During this two month period, teams worked tirelessly to prepare launch vehicles and payloads for launch. “Maintaining the launch schedule and continuing planned maintenance at this exceptional pace was possible thanks to the dedication of all stakeholders,” commented Didier

Faivre, Director of the Guiana Space Centre. Flight VA238 was the 94th Ariane 5 mission.

Robots to Enhance, not Replace Humans in most Jobs: ARM Survey

CAMBRIDGE, England–(BUSINESS WIRE)–Consumers who believe AI will lead to rampaging, job-taking robot chaos are in the minority according to an ARM-commissioned independent global survey of nearly 4000 consumers. When considering a future where Artificial Intelligence (AI) is increasingly part of their lives, 30 percent of consumers identified “fewer or different jobs for humans” as the biggest drawback. However,

in Asia responding most positively, followed by the US and then Europe. Overall, consumers were surprisingly optimistic on the future outlook with 61 percent believing that “society would become better” with increased automation and AI. In particular they support applications in health care and science, and are prepared to trust machines to diagnose illnesses, drive cars and be personal companions. Key Survey Findings Summary:

respondents remained positive that robots would enhance rather than replace humans in most jobs, and assist by increasingly performing more tedious and dangerous jobs. “It is encouraging to see the survey results highlighting the optimism and opportunities tied to AI, but we are just scratching the surface of its potential,” said Joyce Kim, vice president, global marketing, brand and communications, ARM. “The impact of AI on jobs will be disruptive but it can be a manageable and highly positive disruption in terms of opportunities and enhancing our lives. If we increase our investments in STEM and educating the next-generation workforce on AI technologies, we can ensure they are not left behind in the robot economy.” The survey was carried out by Northstar Research Partners and ARM. Researchers surveyed only consumers with some knowledge of AI, gauging opinions from nearly 4,000 respondents across the US, UK, Sweden, Germany, China, Taiwan, Japan and South Korea. Survey respondents believed that jobs in manufacturing and banking would be most disrupted by new AI technologies while professions related to cooking, fire-fighting and farming will continue to be the domain of humans. This was the view of most people surveyed about a robotic future; with those surveyed

Benefits vs Drawbacks for Consumers What is the biggest benefit of a future in which AI significantly impacts life? 37% believe there will be advancements that help humans, i.e., in medicine and science 29% believe tedious or dangerous tasks will be done by robots 19% believe in lower business cost leading to better service and lower prices 11% see less chance of human accidents/ mistakes 5% more free time What is the biggest drawback of a future in which AI significantly impacts life? 30% Fewer or different jobs for humans 20% Giving some control over our lives to machines 18% More data being shared and potentially stolen online 12% Societal issues around fewer opportunities for humans/ feeling less useful/ too much free time 11% Machines becoming independent and able to think for themselves 9% Tendency to build relationships with machines more than humans

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LatestNews

SES and MDA Announce First Satellite Life Extension Agreement

plans to include a refuelling payload to extend the life of satellites that are low on propellant. “Satellite in-orbit servicing is of upmost importance to next- generation architectures for communications satellites. It enables satellite operators like us to have more flexibility in managing our fleet and meeting our customers’ demands,” said Martin

L U X E M B O U R G – ( B U S I N E S S WIRE)–SES (Euronext Paris:SESG) (LuxX:SESG) and MDA, a global communications and information company, announced today an agreement for an initial satellite life extension mission using an on-orbit refuelling vehicle being built by SSL, a US based subsidiary of MDA and a leading provider of innovative satellites and spacecraft systems.

Halliwell, Chief Technology Officer at SES. “After witnessing the due diligence of SSL’s and MDA’s technical expertise, we are confident that its new venture is the best partner in the refuelling mission field, and will be able to help SES get more value out of an on-orbit satellite.” “As a pioneer in next-generation fleet capabilities, SES is clearly committed to improving the space and satellite ecosystem,” said Howard L. Lance, President and CEO at MDA. “We are very pleased to have this refuelling contract with SES and are excited to provide them with more options in fleet management.” The satellite servicing spacecraft vehicle is planned for launch in 2021

SES will be the first commercial customer to benefit from the satellite refuelling service, and will be able to activate the service whenever required with minimal disruption to spacecraft operation. The agreement also includes an option for further life extension missions. SES will work with a new venture, Space Infrastructure Services (SIS), which will commercialise sophisticated satellite servicing capabilities. SIS has contracted SSL to design and build the highly-capable satellite servicing spacecraft vehicle to meet the needs of the US Defense Advanced Research Projects Agency (DARPA)’s Robotic Servicing of Geosynchronous Satellites (RSGS) programme, which is designed to inspect, repair, relocate and augment geosynchronous satellites and

Intel Takes Another Major Step in Memory Leadership Intel has delivered the world’s first commercially available 64-layer, TLC, 3D NAND solid state drive (SSD). While others have been talking about it, we have delivered. solutions that deliver a better experience wherever compute and data come together. We continue to invest in both Intel® 3D NAND technology and Intel® Optane™ technology to make that happen.

Today we are announcing the new Intel® SSD 545s for the computer client. This is a high-quality, reliable drive for the mainstream market that delivers great performance for older PCs or new value PCs. This technology leadership product can be purchased at Newegg* beginning today. At Intel, our commitment is to drive platform-connected

Intel has outlined on many occasions how today’s data explosion presents the industry an opportunity to derive more

value out of that data. The challenge of the past has been affordability and performance of storage. That’s where TLC, 3D NAND comes into play. Based on our 30 years of

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proven, high-volume manufacturing process – enabling us to accelerate transitions from 2D to 3D, MLC to TLC, and now 32-layer to 64-layer products. This next generation of process leadership will enable a smooth, easy migration and validation cycle for our existing data center customers from today’s 32-layer products to 64-layer product extensions. It also enables an expanded product portfolio that supports new business client and embedded products. We have very strong generational synergy in our factories and expect a fast ramp of bit supply based on 64-layer, TLC, 3D NAND by mid-2018. Realizing the promise of the future is about bringing data and compute closer together for a better experience.

memory experience, we’ve optimized the 3D NAND floating gate architecture and manufacturing process. Intel® 3D NAND technology is a floating gate architecture that gives us the world’s best areal density today and provides scalability for the future. This is based upon having a smaller cell size and by placing control logic under the memory array. Having the world’s best areal density means we can scale to large capacity and deliver more gigabytes per wafer. Our experience with designing this architecture into SSD solutions has enabled us to rapidly improve performance, power consumption, performance consistency and reliability with each generation. Additionally, floating gate technology is manufactured on a

LETI AND FRAUNHOFER TEAM UP TO STRENGTHEN MICROELECTRONICS INNOVATION IN FRANCE AND GERMANY

strengths to the task of keeping France and Germany’s microelectronics industries in the forefront – and offer our innovations across Europe.” “Micro-/nanoelectronics and smart systems are key enabling technologies for the economic success of Europe, especially in France and Germany. Thus,

Two leading European research institutes today announced their new collaboration to develop innovative, next-generation microelectronics technologies to spur innovation in their countries and strengthen European strategic and economic sovereignty. Leti, a research institute of CEA Tech in Grenoble, France, and the Berlin-

Europe can no longer afford to scatter its research competences. For the benefit of industry, joining forces will become more and more important, not only for industry but also for RTOs,” Lakner explained. “The new cooperation agreement will be the starting point for a strategic research cooperation of the two countries in order to jointly support the upcoming EC initiative, Important Project of Common European Interest (IPCEI), on micro- and nanoelectronics.” Specific R&D projects that the collaboration will focus on include: Silicon-based technologies for next-generation CMOS processes and products, including design, simulation, unit process and material development as well as production techniques Extended More than Moore technologies for sensing and communication applications Advanced-packaging technologies. The second phase of the collaboration may be expanded with additional academic partners and other countries, as needed.

based Fraunhofer Group for Microelectronics, Europe’s largest R&D provider of smart systems, will initially focus on extending CMOS and More-than-Moore technologies to enable next- generation components for applications in the Internet of Things, augmented reality, automotive, health, aeronautics and other sectors, as well as systems to support French and German industries. The agreement was signed today by Leti CEO Marie Semaria and Fraunhofer Group for Microelectronics Chairman Hubert Lakner during Leti Innovation Days, which are marking Leti’s 50th anniversary. “The ability to, one, develop key enabling technologies that overcome the formidable technical challenges that our leading technology companies will face, and, two, transfer them quickly to industry, is an essential focus for research institutes and industrials in France and Germany,” Semaria said. “Building on our previous, successful collaborations, Leti and the Fraunhofer Group for Microelectronics will bring our complementary

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Informational and educational activities about passive components

Waldenburg/Germany, Lanskroun/Czech Republic, 29 June 2017 – Würth Elektronik eiSos is pleased to announce its cooperation with and support for the European Passive Components Institute s.r.o. (EPCI). The cooperation includes the development of easy-to-use web-based tools for designers of passive component hardware, educational tools for schools, and promotion of the passive components industry to everyone interested in this field.

technologies prefer open web sources to get the latest information, benchmarking, knowledge base, etc. Easy to find, online resources of passive components information, such as EPCI activities and its website, represent one of the important communication channels that are growing in influence,” said Alexander Gerfer, CTO Würth Elektronik eiSos Group. “It is our great honour to establish a cooperation with leading European passive

Würth Elektronik eiSos has become a gold sponsor of EPCI and co-sponsor of the upcoming international Passive Components Networking Days PCNS in Brno, Czech Republic, in September 2017. “Our aim is to be a valued part of the upcoming new digital age based on advanced modern electronics. Designers of such enabling

component manufacturer Würth Elektronik eiSos who shares our visions and missions. It is a further strong motivation for us to continue in our efforts to support the passive components industry and develop new web-based online tools,” said Tomas Zednicek, President of EPCI.

Samsung Introduces Image Sensor Brand ‘ISOCELL’ at 2017 MWC Shanghai

Samsung Electronics, a world leader in advanced semiconductor technology, today introduced its image sensor brand ‘ISOCELL®’ as well as demonstrated leading-edge solutions at the 2017 Mobile World Congress (MWC) Shanghai. Samsung’s brand for its image sensor lineup is named after the company’s own ISOCELL technology, which is the optimum solution

ISOCELL Slim sensors adopt the smallest pixel sizes available in the market at 0.9-1.0um, yet produce high quality images for the slimmest devices ISOCELL Dual sensors can be mixed and matched in various combinations on consumer devices to bring about features demanded in the latest dual camera trend “Samsung ISOCELL is a brand that

for today’s devices that require ultra-slim designs with high quality cameras. First introduced in 2013, ISOCELL technology separates each pixel with a physical barrier that reduces color crosstalk among pixels. This allows high color fidelity, enabling excellent image quality even with smaller pixels. Samsung ISOCELL is underlined by four technological sub-brands- Bright, Fast, Slim and Dual-that respond to specific market demands: ISOCELL Bright sensors deliver bright and sharp images with high color fidelity and reduced noise in low light environments ISOCELL Fast sensors provide fast autofocus onto still or moving objects even when dark

represents the essence of our leading pixel technologies. We expect the ISOCELL brand to help consumers easily acknowledge and confide in camera performance as well as overall quality of the device,” said Ben Hur, Vice President of System LSI marketing at Samsung Electronics. “With our advanced image sensor technologies, Samsung will continue to bring innovation to cameras used in smartphones and other applications.” At MWC Shanghai, Samsung will be featuring advanced logic solutions, including the Exynos 9 series with 10-nanometer FinFET process technology, for a wide range of platforms such as mobile, Virtual Reality (VR) and wearable devices.

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LG TO SUPPLY NEXT GENERATION ADAS CAMERAS TO PREMIUM GERMAN AUTOMAKER

LG’s Vehicle Components Business Sees Big Growth Ahead in Automotive AI SEOUL, June 29, 2017 — LG Electronics (LG) has been selected by a premium German automaker to supply ADAS (Advanced Driver Assistance Systems) camera modules and related software for the company’s next generation vehicles. The LG-designed ADAS camera is capable of collecting traffic information to help drivers make better decisions and increase safety on the road. It can accurately recognize and

vehicles. Traffic Sign Recognition and High Beam Assist are other advanced features of the LG ADAS camera. LG’s ADAS camera benefits from years of innovation and technological knowledge gleaned from the company’s leadership in mobile communications, image recognition and connectivity. LG announced earlier this year that artificial intelligence and deep learning technology will be a priority in the company’s strategy going forward.

respond to surrounding environments – even at busy intersections – using the camera. As a key component of an overall smart car system, the LG camera can detect objects from a distance and apply Autonomous Emergency Braking if a collision is imminent. The camera can also help keep the car in the lane with Lane Keeping Assist technology as well as at a safe distance from other

“This is the kind of partnership we envisioned when we established the LG Vehicle Component Company four years ago,” said Lee Woo-jong, president of the Vehicle Components Company of LG Electronics. “Partnerships like these will help us realize the ultimate goal of bringing decades of LG innovation and know-how from the home into the automobile.”

NXP Brings Better Fan Experience to 2017 FIFA Confederations Cup with Secure Contactless Ticketing and Communication

As the 2017 FIFA Confederations Cup heads into the championship game, thousands of fans attending this world-class football event also enjoyed convenient and secure access to Russia’s spectacular stadiums with NXP-enabled contactless smart-card technology. Thanks to NXP MIFARE product technology in the electronic tickets for the event, fans had quick, secure stadium access to the matches. NXP is the leader in contactless smart

EV1 promotes efficiency for access with improved protection against counterfeit tickets, saving fans time to get into an event and to their seats. “Whether you’re a Chilean or German fan, attendees joining the tournament in Saint Petersburg can expect secure, safe and efficient access,” said Markus Staeblein, vice president and general manager

secure mobility and retail at NXP. “We are proud that MIFARE products have been chosen to support the fan experience at this event.” For more information about NXP MIFARE contactless technology: https://www.mifare.net/en/products/chip- card-ics/mifare-ultralight/mifare-ultralight-ev1/.

card technology for international sporting events around the world, and the usage of the MIFARE-based solutions at the FIFA Confederations Cup, the world’s fourth largest international sports tournament, highlights another achievement in the use of MIFARE for secure contactless access and connectivity. Specifically, the MIFARE Ultralight

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Rohde & Schwarz Test and Measurement Division under new leadership

Effective July 1, 2017, Andreas Pauly, who was previously Vice President Signal Generators, Audio Analyzers and Power Meters, has taken over as Executive Vice President of the Test and Measurement Division at Rohde & Schwarz. Consequently, he was also appointed to the board of directors.

Vice President of the Test and Measurement Division. During this time, he significantly contributed to the development of the Test and Measurement Division and created the basis for its continuing success as the strongest Rohde & Schwarz division. Andreas Pauly joined Rohde & Schwarz in 1996 as a software engineer. In 2003, he assumed his first managerial position in the company and in 2015 he was appointed Vice President Signal Generators, Audio Analyzers and Power Meters. Mr. Pauly advanced the expansion of the microwave product portfolio

Andreas Pauly, 47, succeeds Roland Steffen, who will retire at the end of 2017. Until that point in time, Mr. Steffen will support his successor as he settles into his new position. Roland Steffen has been with Rohde & Schwarz for 40 years, 14 of which as Executive

Andreas Pauly

and continued his business unit’s success story.

Litigation Against Western Digital Corporation

TOKYO—Toshiba Corporation and Toshiba Memory Corporation today filed a petition with the Tokyo District Court against Western Digital Corporation, a U.S. company, and its subsidiary Western Digital Technologies, Inc. (collectively, “WD”) (NASDAQ: WDC), seeking a provisional disposition order for an injunction against acts of unfair competition, and also brought suit for a permanent injunction, damages and payment of 120 billion yen, alleging violation of the Unfair Competition Prevention Act, among other things. The lawsuit states, as detailed in Toshiba’s June 2, 2017 press release, “Update on Status of Third-party Investment in the Memory Business,” that WD has continually interfered with the bid process related to the sale of TMC. Citing joint venture agreements between Toshiba and SanDisk LLC (including its affiliates, “SanDisk”), the lawsuit also says that WD has exaggerated its consent right – in both public statements and private communications to bidders and others involved in the sale process – in order to interfere with the sale of TMC which does not hold the ownership interests in joint venture companies co-owned with SanDisk. The complaint goes on to state that proceeding with the sales process for TMC does not violate any consent rights held by WD; WD’s claims are

false, designed only to interfere with the sale process, and have damaged Toshiba and TMC. Toshiba and TMC have filed litigation in Japan because WD has improperly obtained Toshiba and TMC’s trade secrets by transferring employees of SanDisk to WD who have access to confidential information of Toshiba and TMC through their participation in the collaboration between SanDisk and Toshiba/TMC. Toshiba considers that WD’s actions are damaging to both Toshiba and TMC, violate the Unfair Competition Prevention Act (Article 2(1) (iv), (vii), (viii), (xv)), and are tortious acts under the Civil Code (Article 709), Toshiba and TMC have filed the petition for a provisional disposition order seeking an injunction to put an end to WD’s damaging actions, and a suit seeking permanent injunction and damages. In addition to intentionally interfering with the TMC sale process via its false claims, the suit says that Toshiba did not object to WD access to information related to the joint venture and development under the assumption that WD will be entering into a contract in respect of information access, however WD had rejected to such contract. Accordingly, to prevent further damage to TMC, TMC believes it has no choice but to block WD’s ability to access such information, starting today.

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Next-gen MCUs enable better design techniques, add functionality and use less power

Jin Xu, Microchip Technology Inc.

Deck The rise in popularity of portable, battery-powered applications over the years has pushed designers to add more features into smaller form factors. This increase in functions, particularly wireless communication, puts a bigger demand on the system power source. The challenge becomes how to implement the desired system functions while extending the battery life. With the help of the most recent advances in microcontroller functionality, including various integrated features and peripherals, power management in embedded designs has become smarter and easier to implement. These MCUs have also enabled better design techniques. Do More With Less Power In case you haven’t noticed, it seems that everything around us is getting smarter and connected to one thing or

another. Your shoes now have sensors that can tell you how to improve your running time by displaying your pace on your smart phone. Your scale can automatically save your weight to your cloud–based tracking application, and it can let you know why that last doughnut you ate was a bad idea - via an alert on your smart phone. Your home security system can inform you about a leak in your garage via text message, thanks to a small wireless sensor placed next to the water heater. The rise in popularity of portable battery-powered applications has increased exponentially, thanks to the technological advances over time. Engineers are constantly being pushed to increase product functionality while reducing its overall dimensions, for each successive design. These additional features put a bigger demand on the system power source. The challenge becomes how to implement these new

functions while extending the battery life, all in a smaller footprint. The conventional approach for battery- powered application design is to keep as many modules in a low-power state for as long as possible, occasionally waking up to perform the required tasks before returning to sleep mode. In a complex design with multiple MCU/MPUs and components, a low pin count 8-bit microcontroller is often used as the system supervisor, to perform housekeeping tasks such as turning on and off modules, as needed, to maximize the power efficiency. Still, the majority of designs have only one main microcontroller with a host of integrated peripherals to implement the required system functions. Therefore, the power consumption of that microcontroller becomes a critical parameter. However, not all microcontrollers are made the same when it comes to low-power

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THE ARROW QUADRO IoT Wi-Fi Kit A faster route to success in the Internet of Things market

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205 days, before triggering an interrupt to wake up the MCU (See Figure 1). Of course, it is rare for an application to have a need to remain idle for such long period, but the capability is present if necessary. When using an internal low power (31kHz) oscillator to feed the resulting (long) timer, the lowest cost solution can be achieved. But the power consumption of this implementation can be reduced further by 50% to around 2.3 µA, by using an external 32kHz crystal connected to the secondary oscillator (SOSC) at a slightly higher cost.. External interrupt sources can also be used to wake up the microcontroller, such as a switch or sensor. Some of the larger MCU/MPUs have multiple interrupts with priority levels, but these features are often not present in most of the low pin count MCUs on the market. Remember the Configurable Logic Cell module that we used to extend the timer period in the previous example? Not only can it be used to create extra interrupt sources when the MCU has only one system INT, the CLC also allows designers to add conditional or sequential logic to the wake-up routine; making it smarter with no additional current draw. If the system requires a number of signals to represent a specific state, in order to wake up the CPU to check the condition, very often it was awakened due to one signal change, only to find the other signals had not yet occurred. It is now possible to configure and combine the available logic functions and state machines in the CLC, or even multiple CLC modules, to create specific wake- up conditions that avoid frequent false triggers and unnecessary power drain. The device wake up time can be a large component of the “running” time in the periodic profile of an application. While for an 8-bit microcontroller internal oscillator this is typically limited to a handful of clock cycles (3-5 cycles

Figure 1: An 8-bit microcontroller’s core-independent peripherals are being used to extend the idle period to 205 days, without any additional components or power penalty

roughly every four hours to read the humidity sensor before going back to sleep again. Does this mean that we must wake up more frequently, due to the internal timer limitations? Not necessarily. One option is to use a Real Time Clock (RTC) and crystal that can provide accurate time keeping in terms of hours, days, months and even years, if needed. Since not all microcontrollers offer an integrated RTC and crystal, often for cost reasons, a stand-alone RTC can also be considered. Core-Independent Peripherals Another option is to extend the idle period without any additional components or power penalty is to use the unique peripherals found in some next-generation 8-bit microcontrollers (such as Microchip Technology’s PIC® MCUs). For example, designers can connect one of these MCU’s Configurable Logic Cells (CLCs) and its Numerically Controlled Oscillator (NCO) to the 16-bit timer, in order to extend the period from 17 seconds to

performance. This is where an 8-bit microcontroller can outshine a 32-bit device in many cases. Some 8-bit MCUs consume as little as 20 nA in the lowest power setting, while 32- bit bottoms out around 10 to 20 times higher, at best. There are a number of ways to wake up the microcontroller from sleep mode. Using the microcontroller’s internal timers to wake up the system periodically is a common practice. The timer can be configured to trigger an interrupt after it overflows. A 16- bit timer with 1:8 pre-scaler, running off the internal, low-power 31 kHz oscillator (or with an external crystal) can keep the device in sleep for about 17 seconds. Another option is to use the MCU’s Watchdog Timer (WDT), ideally with a maximum idle time of 256 seconds while consuming around 440 nA. (Once again, a typical 32-bit MCU with WDT enabled consumes at least 3 times the current of an 8-bit MCU.) Take an application that doesn’t need to wake up frequently, such as an environmental monitor that wakes up

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Some MCUs integrate a wide variety of low-power active modes. These modes provide the option to turn off or reduce the speed of the core processor, while selectively keeping the system clock active for the on-chip peripherals. One frequently heard statement is “the higher the performance of the core, the faster the execution of the tasks, then the sooner it can return to sleep mode.” While this might be true in some cases, there is a flaw to this logic. We have to remember that the core consumes more power than any other module in the MCU. Additionally, all of the tasks that require the core must be executed sequentially (FIFO), regardless of the speed. Therefore, the core can’t be turned off until the last task is completed. When a microcontroller can perform some of the required tasks in parallel, using integrated peripherals that can operate independently of the core, then it makes the speed of the core irrelevant while significantly reducing the overall power usage. Core independent peripherals are fully functional while the MCU’s core is in sleep mode. Designing battery-powered applications has become more complex, due to their increasing functionality. Engineers should analyze and fully understand the current-consumption profile of each component in different power and activity modes, in order to achieve the highest battery usage efficiency. The core independent peripheral set found in the next generation of 8-bit microcontrollers enable engineers to be creative with their designs, without sacrificing performance. Note: PIC is a registered trademark of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are the property of their respective companies.

Figure 2: A graphic representation of a microcontroller’s current consumption over time

corresponding to 200ns to 1us), in a 32-bit architecture, employing deep- sleep techniques to limit leakage currents, it becomes a matter of tens of microseconds, often voiding any/all benefits resulting from the subsequent typical faster execution speed. While we would like to do everything in sleep mode, certain tasks must be performed in active mode where the MCU core consumes the highest amount of power relative to all other modules. This is where things can get a bit tricky. Figure 2 is a simplified graphic representation of the system current consumption over time. The area under the current-consumption line represents the total discharge over time, measured in Coulombs. If the sum of all the areas under the sleep- mode period is much greater than the active mode, then the sleep-current value is more critical since most of the energy consumption takes place in a low-power mode. Vice versa, if the sum of the area under the active-mode period is significantly higher, then the sleep current value and the time spent in sleep mode become irrelevant. Applications with wireless communication, such as Wi-Fi ®

or Bluetooth ® LE, are particularly challenging systems in which to reduce power consumption. Designers of these systems must consider how much data is transmitted or received, since this will directly impact the overall current consumption. Wireless modules can be used in “Beacon Mode,” to wake up periodically and search for signals; or they can go into standby mode when not in use. In such wireless systems the MCU processing speed is actually irrelevant as the application is most often I/O bound, but the MCU wake up time impacts significantly the application profile as the radio circuitry power consumption (typically 10-20 mA) is extended and ends up dominating the application budget. Analog sensors require the use of the MCU’s on-chip ADC module. Typically, the time needed for ADC sampling is much longer than the conversion time. The more time spent in active mode, the more current is consumed. However, some MCUs have ADC modules that allow conversions in sleep mode, which saves power by minimizing the time spent in active mode.

60GHz technology opens door to WiGig® and 5G applications

Imec

5G technology through various business models. And going even a step further, imec researchers are also developing ATTO cell technology for data-intensive industrial applications that require even higher bitrates, higher density and lower latency than what 5G can offer... 60GHz technology for indoor data-intensive applications Today’s wireless indoor applications typically use Wi-Fi compliant devic- es to support wireless network connectivity. These devices are based on the IEEE 802.11 standards

The 5th generation of mobile networks (or 5G) promise higher data rates and lower latency, and will support a higher density of mobile broadband users than the current4Gstandards.Wireless communication radios that operate at frequencies around 60GHz have large potential to support these 5G communication networks. An example is imec’s prototype 60GHz transceiver, suitable for both indoor WiGig® applications (such as video distribution in the home) and outdoor 5G applications (e.g. fixed wireless access). Companies can access imec’s

and deploy the 2.4 and 5GHz radio bands. But the next generation of wireless technologies is expected to face spectrum scarcity in the frequency band below 10GHz. This is due to the exploding number of users and products, and to the increasing number of data-intensive applications running on today’s consumer electronic products. On top of that, a whole range of new applications comes in sight, including video distribution in the home, fast exchange of GBytes of data between tablets and smartphones, immersive gaming and wire-less docking of laptops. To cope with the upcoming spectrum scarcity, bandwidth is being sought at millimeter-wave frequencies – ranging from 24 to

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